Methods for microwave melting of fiber mixtures to form composite materials include placing the fiber mixture in a receptacle located in a microwave oven. The methods further include microwave heating the mixture, causing a heat activated compression mechanism to automatically increase compressive force on the mixture, thereby eliminating air and void volumes. The heat activated compression mechanism can include a shape memory alloy wire connecting first and second compression brackets, or one or more ceramic blocks configured to increase in volume and thereby increase compression on the mixture.

A blister pack includes a housing having a plurality of cavities and a cover sealed to the housing and enclosing the cavities. The cover including a base layer, at least one security element, and a heat protective layer. The heat protective layer includes one of an amorphous polymer and a semi-crystalline polymer.

A method for connecting the joint of two ends of at least one chassis sealing element. In order to allow a secure and quick connection of the ends and allow an additional unhindered passage of air and moisture between hollow chambers within the chassis sealing element via the joint when using a profiled hollow chamber, the ends are first arranged at a distance to each other, and a shapeless bonding agent is applied to at least one end. The bonding agent is then heated, and the ends are brought into mutual contact, whereby the ends are bonded at the joint by way of the heated bonding agent.

A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.

The invention relates to the use of a low Tg compatible resin as an adhesive layer for the welding of a thermoplastic composite structure to a thermoplastic or thermoset structure. The invention is especially good for the welding of large parts, such as wind turbine halves and spar caps. A useful thermoplastic composite is one formed by the infusion and curing of long fibers by a reactive acrylic liquid resin system, such as ELIUM® resin systems from Arkema.

A method to form automobile vehicle acoustic insulators includes as stages: forming a fiber mass by mixing a low melting point polymeric fiber and a high melting point polymeric fiber in predefined volumes in a mixing device; adding a water volume to the fiber mass to create a semi-solid mass; placing the semi-solid mass in a mold; internally heating the semi-solid mass in the mold using microwave energy; and expelling a first portion of the water volume through apertures created in the mold.

In order to thermally cure a thermosetting adhesive quickly and with less energy, the bonded article (10) according to the present invention comprises an adherend member (1) having a thermal conductivity of 1 w/m.Math.K or more, an adherend member (2) made of a material which can adhere to the adherend member (1), and an adhesion portion that is formed of a cured product of a thermosetting adhesive (3) and that is in contact with both the adherend member (1) and the adherend member (2), wherein the adherend member (1) has a heat transfer-inhibiting structure (4) which inhibits the transfer of heat from a portion thereof in contact with the adhesive (3) to a peripheral portion thereof.

A blister pack includes a housing having a plurality of cavities and a cover sealed to the housing and enclosing the cavities. The cover includes a base layer, at least one security element, and a heat protection layer. The heat protection layer includes one of an amorphous polymer and a semi-crystalline polymer.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region, i.e., no cavity modes or standing waves are established within the fixture. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn configured to spread the microwave power laterally over a selected area while maintaining a single propagating mode. The invention may be used to enhance catalytic reactions for research and other purposes. Alternatively, the invention may be configured to perform spot curing or repair operations involving adhesives and composites.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.