The invention relates to a method for welding a connection between a first joining surface of a first molded part and a second joining surface of a second molded part, which by means of a clamping device are moved and braced with their joining surfaces in contact with one another, wherein the first molded part is at least partially transparent for a primary beam of a first radiation source and at least partially absorbent for a secondary beam of a second radiation source, and the second molded part is at least partially absorbent for the primary beam, wherein sequentially the second molded part is irradiated with the primary beam and the first molded part is irradiated with the secondary beam.

A method of directly joining a polymer to a metal along a joint interface through the formation of C—O—M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; and applying force to the joint interface of the metal and the polymer to generate intimate atomic contact between the metal and the polymer to create C—O—M chemical bonds between the metal and the polymer.

A method of directly joining a polymer to a metal along a joint interface through the formation of C—O-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create C—O-M chemical bonds between the metal and the polymer.

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily.

[Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.

A method of directly joining a polymer to a metal along a joint interface through the formation of CO-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create CO-M chemical bonds between the metal and the polymer.

The invention relates to a method for welding a connection between a first joining surface of a first molded part and a second joining surface of a second molded part, which by means of a clamping device are moved and braced with their joining surfaces in contact with one another, wherein the first molded part is at least partially transparent for a primary beam of a first radiation source and at least partially absorbent for a secondary beam of a second radiation source, and the second molded part is at least partially absorbent for the primary beam, wherein sequentially the second molded part is irradiated with the primary beam and the first molded part is irradiated with the secondary beam.

In one example, a method for printing a three-dimensional (3D) object is described. The method may include a processor depositing a layer of a sinterable material on a support member, and preheating the layer of the sinterable material using a moveable radiation source. The method may further include the processor depositing a fusing agent on an imaged area of the layer of the sinterable material and fusing the imaged area of the layer of the sinterable material using the moveable radiation source.

A method of directly joining a polymer to a metal along a joint interface through the formation of CO-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; and applying force to the joint interface of the metal and the polymer to generate intimate atomic contact between the metal and the polymer to create CO-M chemical bonds between the metal and the polymer.

In one example, a method for printing a three-dimensional (3D) object is described. The method may include a processor depositing a layer of a sinterable material on a support member, and preheating the layer of the sinterable material using a moveable radiation source. The method may further include the processor depositing a fusing agent on an imaged area of the layer of the sinterable material and fusing the imaged area of the layer of the sinterable material using the moveable radiation source.