A method of securing a first component part and a second component part together, the method comprising providing an electrically conductive member between a first surface of the first component part and a facing first surface of the second component part and securing the first and second components together by passing a current through the electrically conductive member. The electrically conductive member is distributed across at least 50% of the surface area of the first surface of the first component part.

A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

A method of securing a first component part and a second component part together, the method comprising providing an electrically conductive member between a first surface of the first component part and a facing first surface of the second component part and securing the first and second components together by passing a current through the electrically conductive member. The electrically conductive member is distributed across at least 50% of the surface area of the first surface of the first component part.

A method of joining workpieces includes the steps of bringing a first workpiece and a second workpiece together, induction heating a susceptor material, and pressing the workpieces together. Each workpiece may include a thermoplastic material, and the workpieces are brought together at a joint interface so that a protrusion of the first workpiece is aligned with a receptacle of the second workpiece. The susceptor material is in contact with the thermoplastic material of the first workpiece during heating such that the thermoplastic material of the first workpiece softens. The step of pressing is performed while the thermoplastic material of the first workpiece is softened, thereby reshaping the first workpiece where the susceptor material is in contact with the thermoplastic material of the first workpiece. The protrusion is deformed to form an interlock with the receptacle at the joint interface.

A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

A method of joining workpieces includes the steps of bringing a first workpiece and a second workpiece together, induction heating a susceptor material, and pressing the workpieces together. Each workpiece may include a thermoplastic material, and the workpieces are brought together at a joint interface so that a protrusion of the first workpiece is aligned with a receptacle of the second workpiece. The susceptor material is in contact with the thermoplastic material of the first workpiece during heating such that the thermoplastic material of the first workpiece softens. The step of pressing is performed while the thermoplastic material of the first workpiece is softened, thereby reshaping the first workpiece where the susceptor material is in contact with the thermoplastic material of the first workpiece. The protrusion is deformed to form an interlock with the receptacle at the joint interface.

A composite fibrous susceptor for use in induction welding is described, along with methods of its construction and use. The composite fibrous susceptor can include a magnetically susceptible continuous fiber in conjunction with a thermoplastic polymer. The composite fibrous susceptor can be deposited according to an additive manufacturing process on a surface to be bonded according to an induction welding process.

A composite fibrous susceptor for use in induction welding is described, along with methods of its construction and use. The composite fibrous susceptor can include a magnetically susceptible continuous fiber in conjunction with a thermoplastic polymer. The composite fibrous susceptor can be deposited according to an additive manufacturing process on a surface to be bonded according to an induction welding process.

A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.