The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

A composite material includes: a metal substrate and a polymer layer which are directly interconnected by an adhesion promoter layer. The adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the organosilicon compound includes a siloxane, silane, or silicate.

A method of making patterned structured solid surfaces is disclosed that includes filling a structured template with backfill material to produce a structured transfer film, patternwise curing the backfill material to produce cured areas and uncured areas in the structured transfer film, and laminating the structured transfer film to a receptor substrate. The structured template is capable of being removed to form structured and unstructured backfill layers. The structured and unstructured backfill layers may then be blanket cured. The backfill layer can include at least two different materials, one of which can be an adhesion promotion layer. In some embodiments the backfill layer includes a silsesquioxane such as polyvinyl silsesquioxane. The structured transfer film is a stable intermediate that can be covered temporarily with a release liner for storage and handling.

Methods of making articles using structured tapes are disclosed. The structured tapes may include a structured template layer having a structured surface and an opposed second surface and an uncured backfill layer, the uncured backfill layer has a lower refractive index than the structured template layer, and the uncured backfill layer has a structured surface conforming to the structured surface of the structured template layer and an opposed second surface. The structured tapes may include a structured template layer having a structured surface and an opposed second surface and an uncured backfill layer, the uncured backfill layer has a higher refractive index than the structured template layer, and the uncured backfill layer has a structured surface conforming to the structured surface of the structured template layer and an opposed second surface. The structure tapes may be laminated via the uncured backfill layer to a receptor substrate to form an article.

A resin-rubber composite in which a polyamide-based resin-molded product or a polyphenylene sulfide-based resin-molded product is directly vulcanization-bonded to a peroxide-crosslinkable nonpolar rubber composition, which forms a rubber layer, without interposing an adhesive, wherein both resin-molded products have a polymerized film with a radical, which is formed by activating the surface of the product, in the case of polyamide-based resin-molded products, by low-pressure plasma treatment by a microwave method using inert gas, or by activating the surface of the product, in the case of polyphenylene sulfide-based resin-molded products, by low-pressure plasma treatment by a microwave method using active gas, and then performing low-pressure plasma treatment by a microwave method using a hydrocarbon-based monomer in both cases. The resin-rubber composite can be effectively used for drum seals, automobile parts such as side cover seals for transmissions, anti-vibration rubber, resin rubber laminate hoses, and the like.