A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.

A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.

A method for connecting at least two structural parts of an orthopedic component, wherein the structural parts are retained in an orienting device while oriented in relation to each other, and an intermediate space thus being formed between the structural parts. The orienting device and the structural parts together form a cavity, which has a flow connection to at least one feed connection, via which an adhesive for adhesively bonding the structural parts is introduced into the cavity.

A method for connecting at least two structural parts of an orthopedic component, wherein the structural parts are retained in an orienting device while oriented in relation to each other, and an intermediate space thus being formed between the structural parts. The orienting device and the structural parts together form a cavity, which has a flow connection to at least one feed connection, via which an adhesive for adhesively bonding the structural parts is introduced into the cavity.

A load introduction device and a method for adhesive bonding of a load introduction device for fiber composite materials is disclosed. A sealant, particularly a first adhesive is used in the creation of a cavity and in the creation of a secured arrangement for the injection of adhesive into the cavity.

An example method of joining a first structure and a second structure is described that includes forming a bond cavity between a first structure and a second structure, placing a semi-permeable breather material at one or more exits of the bond cavity, placing a vacuum bag around the bond cavity and the semi-permeable breather material, evacuating the bond cavity via a vacuum port and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated, and curing the adhesive via one or more heaters to bond the first structure to the second structure.

A method for making a connection between a pair of objects includes using a fixture to hold in place shims used to control the gap thickness between the objects. The gap may be subsequently filled with adhesive that is then cured. The fixture may be a flexible piece of material that is able to withstand the cure environment, for example being able to withstand heat used to cure the adhesive. The fixture may facilitate maintaining the proper gap by holding the shims in their proper places and orientation until the adhesive is cured and the shims are removed. The use of the fixture may improve the uniformity of the gap at less effort, and may reduce defects in the adhesive layer, for example by facilitating removal of the shims without disturbing or damaging the adhesive, such as by pulling the shims straight out of their locations in the gap.

A method for making a connection between a pair of objects includes using a fixture to hold in place shims used to control the gap thickness between the objects. The gap may be subsequently filled with adhesive that is then cured. The fixture may be a flexible piece of material that is able to withstand the cure environment, for example being able to withstand heat used to cure the adhesive. The fixture may facilitate maintaining the proper gap by holding the shims in their proper places and orientation until the adhesive is cured and the shims are removed. The use of the fixture may improve the uniformity of the gap at less effort, and may reduce defects in the adhesive layer, for example by facilitating removal of the shims without disturbing or damaging the adhesive, such as by pulling the shims straight out of their locations in the gap.

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.