Provided are a joining structure, a joining method, an exterior body for a wire harness, and a wire harness capable of firmly joining members having different physical properties while reducing the thickness of a joint part. The joining structure 10 joins a first member 1 made of a first resin and a second member 2 made of a second resin, wherein: the second resin has physical properties having a higher foaming ratio than the first resin; and a recessed joint part 3 is provided which reaches at least the inside of the first member 1 from the outer surface side of the second member in a state in which the first member 1 and the second member 2 are superimposed. Furthermore, a method for manufacturing the joining structure 10 comprises the steps of: superimposing a first member 1 made of a first resin and a second member 2 made of a second resin having physical properties having a higher foaming ratio than the first resin; and joining the first member 1 and the second member 2 by forming the recessed joint part 3 by pressing and hot-melting the second member 2 until the recessed joint part 3 reaches at least the inside of the first member 1 from the outer surface side of the second member 2.

A joint structure includes a reinforcement portion that is formed by joining a composite material and a reinforcing material through an adhesive. The composite material includes a plate portion that is formed by laminating a plurality of fiber sheets, and a raised portion that is formed by laminating a plurality of fiber sheets in addition to the plurality of fiber sheets of the plate portion, and surfaces of the plate portion and the raised portion are covered with a single fiber sheet. The reinforcement portion includes the raised portion and the reinforcing material that is bonded to the raised portion through an adhesive. A first boundary between the plate portion and the raised portion and a second boundary between the raised portion and the reinforcing material are located at different positions in an in-plane direction of a laminated interface between the fiber sheets that are laminated.

A process for welding profiles (1) of a thermoplastic or thermoplastic elastomer to a top layer (3) of a belt (2), such as a conveyor belt, also being made of a thermoplastic or thermoplastic elastomer. The process uses thermal impulse welding and applies the welding heat onto the surface (21) of the belt (2) which is opposite to the top layer (3). The process is in particular suited for welding TPO profiles to TPO top layers.

A bonded composite joint includes a first carbon fiber-reinforced polymer (CFRP) panel; a second CFRP panel; a corrugated structure placed between the first and second CFRP panels; and an adhesive placed between the first and second CFRP panels and in contact with the corrugated structure. The corrugated structure has a shape defined by a given wavelength λ.

A welder for joining two polymeric sheets together using a wedged heating element allows for a heating profile on opposite faces of the heating element to be varied by controlling where each of the polymeric sheets contacts the corresponding face.

Disclosed herein is a method of manufacturing a headlining, using a moisture-curing adhesive that can be molded at a relatively low temperature and enables energy saving by not requiring a condition in which bonding surfaces are preheated to an excessively high temperature. A headlining manufactured thereby the same method is also disclosed. The method includes coating a fabric with a moisture-curing adhesive, curing the moisture-curing adhesive by spraying water onto the moisture-curing adhesive, forming a headlining member by putting the fabric coated with the moisture-curing adhesive on a substrate after the curing, and pressing the headlining member so that the fabric and the substrate are bonded to each other and the headlining is shaped at the same time, after the forming.

An object of the present invention is to provide a thin volume hologram sheet to be embedded sufficiently resistant to a mechanical stress such as a stress including a tensile stress, a shear stress and a compression stress at the time of processing even under a heating condition, a forgery prevention paper and a card using the same. The object is achieved by providing a volume hologram sheet to be embedded comprising a volume hologram layer, and a substrate disposed only on one side surface of the volume hologram layer using an adhesion means, wherein a peeling strength of the volume hologram layer and the substrate is 25 gf/25 mm or more.

A method for bonding two elements, the method including receiving first and second elements, the first element being a composite material; applying a laser-based treatment to a surface of the first element to obtain a treated surface; patterning the treated surface to have plural trenches; applying an adhesive to one of the first and second elements; and joining the first element to the second element so that the adhesive is between the first and second elements.

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state.

A workpiece bonding method according to the present invention is a workpiece bonding method for bonding two workpieces to each other, each of the two workpieces being composed of a material selected from the group consisting of synthetic resin, glass, silicon wafer, crystal and sapphire, the workpiece bonding method including: a surface activation step of activating a bonded surface of at least one of the workpieces; and a laminating step of laminating the two workpieces such that respective bonded surfaces contact with each other, and a pretreatment step of removing moisture from the bonded surface of the workpiece that is to be subjected to the surface activation step is performed before the surface activation step is performed.