A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10.sup.−7/° C. to less than or equal to 120×10.sup.−7/° C. over a range from 25° C. to 500° C.

A method for producing a component from two or more sub-components includes the steps of: producing each of the sub-components using an additive manufacturing process in which a resin, which is radiant-energy-curable, is partially cured using a selective application of radiant energy, wherein each sub-component includes a joint surface in which the resin is partially cured which is cured to a lesser degree than the remainder of the respective sub-component, so as to leave the joint surfaces in a condition suitable for bonding; assembling the sub-components with their respective joint surfaces in mutual contact; and performing a secondary cure of the partially-cured resin at the joint surfaces using an application of radiant energy, so as to further cure the partially-cured resin and bond the sub-components to each other, thereby forming the component.

Provided are a method for producing a thermoplastic liquid crystal polymer (TLCP) film having an improved thermo-adhesive property, a circuit board, and a method for producing the same. The production method of the TLCP film includes preparing a TLCP film as the adherend film and a TLCP film as the adhesive film;

examining each of the prepared TLCP films for a relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the XPS spectral profile so as to calculate a relative intensity X (%) as for the prepared adherend film and a relative intensity Y (%) as for the prepared adhesive film; and

controlling the TLCP film as the adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the controlled adhesive film satisfy the following formulae (1) and (2):

38<X+Y<65   (1)

−8.0<Y−X<8.0   (2).

A method for producing a component from two or more sub-components includes the steps of: producing each of the sub-components using an additive manufacturing process in which a resin, which is radiant-energy-curable, is partially cured using a selective application of radiant energy, wherein each sub-component includes a joint surface in which the resin is partially cured which is cured to a lesser degree than the remainder of the respective sub-component, so as to leave the joint surfaces in a condition suitable for bonding; assembling the sub-components with their respective joint surfaces in mutual contact; and performing a secondary cure of the partially-cured resin at the joint surfaces using an application of radiant energy, so as to further cure the partially-cured resin and bond the sub-components to each other, thereby forming the component.

The present disclosure generally relates to methods and apparatuses for secondary material deposition and insert deposition during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed chemical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.

An electrowetting element comprising a first fluid, a second fluid immiscible with the first fluid, a first electrode, a second electrode in contact with the second fluid and a first and second support plate. The first support plate comprises the first electrode and a surface. The second support plate comprises a protrusion which overlaps a first surface portion of the surface and which, with a first voltage with a substantially zero magnitude applied between the first electrode and the second electrode, contacts the second fluid without substantially contacting the first fluid. Upon application of a second voltage with a non-zero magnitude between the first electrode and the second electrode, the first fluid moves such that there is substantially no contact between the first fluid and the first surface portion.

A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 2010.sup.7/ C. to less than or equal to 12010.sup.7/ C. over a range from 25 C. to 500 C.

A method for producing a component from two or more sub-components includes the steps of: producing each of the sub-components using an additive manufacturing process in which a resin, which is radiant-energy-curable, is partially cured using a selective application of radiant energy, wherein each sub-component includes a joint surface in which the resin is partially cured which is cured to a lesser degree than the remainder of the respective sub-component, so as to leave the joint surfaces in a condition suitable for bonding; assembling the sub-components with their respective joint surfaces in mutual contact; and performing a secondary cure of the partially-cured resin at the joint surfaces using an application of radiant energy, so as to further cure the partially-cured resin and bond the sub-components to each other, thereby forming the component.

The present disclosure generally relates to methods and apparatuses for secondary material deposition and insert deposition during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed chemical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.

A method producing thermoplastic liquid crystal polymer (TLCP) film(s) may include (i) preparing a TLCP film (adherend film) and a TLCP film (adhesive film); (ii) examining each TLCP film for relative intensity calculated as a ratio in percentage of a sum of peak areas of CO bond peak and COO bond peak based on the total area of C1s peaks in the X-ray photoelectron spectroscopy (XPS) profile to calculate relative intensity X (%) for the adherend film and relative intensity Y (%) for the adhesive film; and (iii) controlling the TLCP film adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the adhesive film satisfy
38X+Y65(1), and
8.0YX8.0(2).