Patent classifications
B29C66/74611
ALTERNATIVE JOINING METHOD
The disclosure relates to an alternative joining method and to the use of the shaped part produced by means of the alternative joining method in drive technology and connection technology.
Pre-stressed curved ceramic plates/tiles and method of producing same
A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.
PRE-STRESSED CURVED CERAMIC PLATES/TILES AND METHOD OF PRODUCING SAME
A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.
Pre-stressed curved ceramic plates/tiles and method of producing same
A pre-stressed curved plate comprising a curved plate having at least one concave surface, the curved plate being enveloped and adhesively bonded with tensioned reinforcing fibers, whereby the reinforcing fibers are first wound around the plate under tension being spaced apart from the concave surface and subsequently subjected to pressure to stretch and bond the reinforcing fibers to the surfaces of the plate, where upon bonding, the tensile strain of the fiber introduces stress in the plate.
Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate
The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
Method of through-thickness reinforcing a laminated material
A method of providing through-thickness reinforcement of a laminated material which includes a matrix material including a step of creating a locally heated zone in the laminated material so as to locally soften the matrix material by focussing a set of at least two energy beams at a location where through-thickness reinforcement is required and a step of inserting a reinforcement element through the thickness of the laminated material at the location of the locally heated zone to through-thickness reinforce the laminated material.