A heat sealer module for a heat-sealing station of a packaging apparatus has a sealing belt for contacting a terminal portion of semi-sealed packages and for guiding the terminal portion of the semi-sealed packages along a main movement direction; the heat sealer module also has a first driving belt and a second driving belt to assist in accompanying the packages in proper position for sealing. A heat sealer having opposed heat sealer modules. A packaging apparatus for heat sealing packages having a vacuum chamber with an elongated opening and a conveyor for receiving semi-sealed packages and for moving the semi-sealed packages relative to the vacuum chamber is disclosed. The packaging apparatus includes evacuation means for evacuating gas present in the semi-sealed packages and forming evacuated semi-sealed packages. The packaging apparatus includes the heat sealer for heat sealing the terminal portion of each evacuated semi-sealed package thereby forming heat sealed packages.

There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.

A resistance welding apparatus can employ a modular power supply system with multiple power supply modules and leads for electrically connecting the modular power supply system to a welding resistor. The resistance welding apparatus is selectively configurable in at least three of (i) a first configuration in which the leads connect the first power supply module to the resistor and the second power supply module is disconnected from the resistor; (ii) a second configuration in which the leads connect the second power supply module to the resistor and the first power supply module is disconnected from the resistor; (iii) a third configuration in which the leads connect the first and second power supply modules to the resistor in series; and (iv) a fourth configuration in which the leads connect the first and second power supply modules to the resistor in parallel.

A process for forming a container from a blank, the process comprising the steps of: thermally inducing one or more fold lines on at least one surface of a container blank fabricated from a thermal insulation sheet material, wherein the blank comprises: a first panel portion; a second panel portion located adjacent the first panel portion and sharing a first common edge therewith; and a third panel portion located adjacent the second panel portion and sharing a second common edge therewith, the second common edge being substantially parallel to the first common edge, wherein the first panel portion and the third panel portion are each associated with a pair of flap members adapted for folding movement relative to the respective first and third panel portions such that, when assembled, each of the flap members overlies an edge of the second panel portion substantially perpendicular to the first common edge and the second common edge, folding the first panel portion of the container blank along a first fold line, wherein when folded, the first panel portion is substantially perpendicular to the second panel portion of the container blank; folding the third panel portion of the container blank along a second fold line, wherein when folded, the third panel portion is substantially perpendicular to the second panel portion and substantially parallel to the first panel portion; sealing a portion of each of the pair of flap members of the first panel portion to a portion of each of the pair of flap members of the third panel portion to form a side seam joint; and sealing a portion of the first panel portion adjacent the side seam joint and a portion of the third panel portion adjacent the side seam joint to an edge of the second panel portion to form a bottom seam joint.

A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

The disclosure refers to a packaging device for manufacturing a packaging for a foodstuff. In particular, the packaging may include a trough-shaped lower packaging part and a top film which can be sealed together along their edges by means of a sealing tool of the packaging device. In order to improve a packaging device completely without evacuation or by evacuation in a simple and inexpensive manner with only a slight negative pressure in such a way that sufficient vapor purging is possible and at the same time cooling of the foodstuff before sealing or excessive degassing of the foodstuff does not take place, vapor can be introduced under pressure between the lower packaging part and the top film at at least one vapor entry point before sealing and can be released into the surrounding atmosphere at an outlet point from the packaging.

A method for joining at least two joining partners includes performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation includes, with a second joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joining partner, and, with the second joining tool, applying high-frequency ultrasonic vibrations to the joining partners. The method further includes, during at least one intermediate time interval between two directly successive ultrasonic joining operations, at least one of actively cooling and heating the second joining tool.

Methods of producing polymer-metal hybrid components that are bonded by C—O-M bonds at the interface using at least one of the hot pressing, rolling, and injection molding methods to create chemical bond formation conditions at the polymer and metal interface. When the thermal cycle and compressive pressure specified herein is combinationally created at the polymer and metal interfaced, strong C—O-M bonds forms at the interface and strongly bonds the metal and polymer together through the reaction carbonyl groups (C═O) in polymer and the metal surface. For polymers lacking enough carbonyl groups, new functional groups can be in-situ generation through introducing distributed air pockets at the polymer-metal interface for forming 3-dimensional distributed C—O-M bonds at the interface.

A water comprising, two component polyurethane dispersion adhesive comprising an anionic polyester polyurethane resin and a solvent-free liquid aliphatic polyisocyanate cross-linker. The dispersion can be reactivated one or more times for edge bonding a flexible sheet material onto a substrate having a main surface, a peripheral surface and an edge connecting the main surface and the peripheral surface.