Improved soles and insoles for shoes, in particular sports shoes, are described. In an aspect, a sole for a shoe, in particular a sports shoe, with at least a first and a second surface region is provided. The first surface region comprises expanded thermoplastic polyurethane (“TPU”). The second surface region is free from expanded TPU.

Improved soles and insoles for shoes, in particular sports shoes, are described. In an aspect, a sole for a shoe, in particular a sports shoe, with at least a first and a second surface region is provided. The first surface region comprises expanded thermoplastic polyurethane (“TPU”). The second surface region is free from expanded TPU.

A sintered body manufacturing apparatus includes a compacting apparatus configured to press a raw powder containing a metal powder into a green compact, a machining apparatus configured to perform a cutting operation on the green compact to produce an unsintered materials, and a green compact conveying path configured to connect the compacting apparatus in series to the machining apparatus to convey green compacts one by one from the compacting apparatus to the machining apparatus.

A method for producing a media-tight material composite, in particular comprising a metal solid body and an optionally electrically insulating plastic at least partially surrounding the solid body, preferably as a component of a preferably shielded electrical interface, wherein surfaces of the solid body that the plastic contacts are subjected to a surface pretreatment in order to promote the adhesion of the plastic to the solid body. The disclosure further relates to a cylindrical metal sleeve, in particular as part of a plug connector, and a plug connector or sensory comprising a metal sleeve, produced by the foregoing method.

A method for producing a media-tight material composite, in particular comprising a metal solid body and an optionally electrically insulating plastic at least partially surrounding the solid body, preferably as a component of a preferably shielded electrical interface, wherein surfaces of the solid body that the plastic contacts are subjected to a surface pretreatment in order to promote the adhesion of the plastic to the solid body. The disclosure further relates to a cylindrical metal sleeve, in particular as part of a plug connector, and a plug connector or sensory comprising a metal sleeve, produced by the foregoing method.

A method of manufacturing a semiconductor device includes providing, in a housing, an insulating substrate having a metal pattern, a semiconductor chip, a sinter material applied on the semiconductor chip, and a terminal, providing multiple granular sealing resins supported by a grid provided in the housing, heating an inside of the housing until a temperature thereof reaches a first temperature higher than a room temperature and thereby discharging a vaporized solvent of the sinter material out of the housing via a gap of the grid and a gap of the sealing resins, and heating the inside of the housing until the temperature thereof reaches a second temperature higher than the first temperature and thereby causing the melted sealing resins to pass the gap of the grid and form a resin layer covering the semiconductor chip.

A molding apparatus includes a heating section, a spreading section, a molding section, a drawing section and a curing section. The heating section which heats a mold material including particles and a binder agent which bonds together the particles, to a temperature equal to or higher than the melting point of the binder agent and forms a fluid mold material. The spreading section forms a mold layer by spreading the fluid mold material. The molding section layers the mold layers. The drawing section applies UV ink to a desired region of the mold layer. The curing section cures the UV ink applied to the desired region of the mold layer.

The disclosure relates in particular to a machine for additive manufacturing by sintering or melting powder using an energy beam acting on a powder layer in a working zone, said machine comprising a device for layering said powder. The device is configured to distribute the powder that are able to travel over the working zone in order to distribute the powder in a layer having a final thickness suitable for additive manufacturing; transfer the powder to a distribution structure by gravity, and control the quantity of powder transferred to the distribution structure.

The disclosure relates in particular to a machine for additive manufacturing by sintering or melting powder using an energy beam acting on a powder layer in a working zone, said machine comprising a device for layering said powder. The device is configured to distribute the powder that are able to travel over the working zone in order to distribute the powder in a layer having a final thickness suitable for additive manufacturing; transfer the powder to a distribution structure by gravity, and control the quantity of powder transferred to the distribution structure.

To provide a porous molding that can be used as a molding that has sufficient strength to be self-supportable even when the dimensions change due to absorbing water and that can be suitably used as a filter for removing impurities in a liquid or gas. A porous molding is achieved by sintering a mixed powder including a dried gel powder and a thermoplastic resin powder, wherein the ratio of average particle diameter d.sub.1 of the thermoplastic resin powder to the average particle diameter d.sub.2 of the dried gel powder d.sub.2/d.sub.1 is 1.3 or greater, and the difference ratio of average particle diameter d.sub.1 of the thermoplastic resin powder to the average particle diameter d.sub.2 of the dried gel powder and the average particle diameter d.sub.3 of the dried gel powder when absorbing water and swelling is (d.sub.3−d.sub.2)/d.sub.1 is 4.0 or less.