An extrusion additive manufacturing process including the step of extruding a polyethylene composition having a melt flow index MIE of at least 0.1 g/10 min., the composition made from or containing: A) from 1% to 40% by weight of a polyethylene component having a weight average molar mass Mw, as measured by GPC (Gel Permeation Chromatography), equal to or higher than 1,000,000 g/mol; B) from 1% to 95% by weight of a polyethylene component having a Mw value from 50,000 to 500,000 g/mol; and C) from 1% to 59% by weight of a polyethylene component having a Mw value equal to or lower than 5,000 g/mol.

A high-strength conductive polymer composite can be made by mixing a a granular polymer and a conductive material, and processing the mixture using angular extrusion.

The present disclosure is directed to processes for producing ultrasonic sealable film structures and flexible containers with ultrasonic seals. The film structure includes a first multilayer film and a second multilayer film. Each multilayer film includes a backing layer and a seal layer. Each seal layer includes an ultrasonic sealable olefin-based polymer (USOP) having the following properties: (a) a heat of melting, Hm, less than 130 J/g, (b) a peak melting temperature, Tm, less than 125 C., (c) a storage modulus in shear (G) from 50 MPa to 500 MPa, and (d) a loss modulus in shear (G) greater than 10 MPa.

The multilayer films are arranged such that the seal layer of the first multilayer film is in contact with the seal layer of the second multilayer film. The seal layers form an ultrasonic seal having a seal strength from 30 N/15 mm to 80 N/15 mm when ultrasonically sealed at 4 N/mm seal force.

The present disclosure is directed to processes for producing ultrasonic sealable film structures and flexible containers with ultrasonic seals. The film structure includes a first multilayer film and a second multilayer film. Each multilayer film includes a backing layer and a seal layer. Each seal layer includes an ultrasonic sealable olefin-based polymer (USOP) having the following properties: (a) a heat of melting, Hm, less than 130 J/g, (b) a peak melting temperature, Tm, less than 125 C., (c) a storage modulus in shear (G) from 50 MPa to 500 MPa, and (d) a loss modulus in shear (G) greater than 10 MPa.

The multilayer films are arranged such that the seal layer of the first multilayer film is in contact with the seal layer of the second multilayer film. The seal layers form an ultrasonic seal having a seal strength from 30 N/15 mm to 80 N/15 mm when ultrasonically sealed at 4 N/mm seal force.

The present disclosure is directed to processes for producing ultrasonic sealable film structures and flexible containers with ultrasonic seals. The film structure includes a first multilayer film and a second multilayer film. Each multilayer film includes a backing layer and a seal layer. Each seal layer includes an ultrasonic sealable olefin-based polymer (USOP) having the following properties: (a) a heat of melting, Hm, less than 130 J/g, (b) a peak melting temperature, Tm, less than 125 C., (c) a storage modulus in shear (G) from 50 MPa to 500 MPa, and (d) a loss modulus in shear (G) greater than 10 MPa. The multilayer films are arranged such that the seal layer of the first multilayer film is in contact with the seal layer of the second multilayer film. The seal layers form an ultrasonic seal having a seal strength from 30 N/15 mm to 80 N/15 mm when ultrasonically sealed at 4 N/mm seal force.

The present disclosure is directed to processes for producing ultrasonic sealable film structures and flexible containers with ultrasonic seals. The film structure includes a first multilayer film and a second multilayer film. Each multilayer film includes a backing layer and a seal layer. Each seal layer includes an ultrasonic sealable olefin-based polymer (USOP) having the following properties: (a) a heat of melting, Hm, less than 130 J/g, (b) a peak melting temperature, Tm, less than 125 C., (c) a storage modulus in shear (G) from 50 MPa to 500 MPa, and (d) a loss modulus in shear (G) greater than 10 MPa. The multilayer films are arranged such that the seal layer of the first multilayer film is in contact with the seal layer of the second multilayer film. The seal layers form an ultrasonic seal having a seal strength from 30 N/15 mm to 80 N/15 mm when ultrasonically sealed at 4 N/mm seal force.

An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.

A method of increasing bubble stability of a needful high molecular weight bimodal high-density polyethylene resin in need thereof, the method comprising subjecting the needful high molecular weight bimodal high-density polyethylene resin to a determined amount of oxygen tailoring of the resin so as to independently increase both the resin's melt storage modulus G (at G=3000 pascals) and complex viscosity ratio SH1000, and thereby make an oxygen-tailored high molecular weight bimodal high-density polyethylene resin having a targeted increase in bubble stability. The method uses a tailoring effective amount of molecular oxygen (O.sub.2) to achieve the desired oxygen tailoring. The method uses these advanced rheological properties from dynamic mechanical spectroscopy, but analyzes the data in a different way that is more sensitive to changes in resin composition and properties, and yet achieves a resin regime having a targeted increase in bubble stability.

A vent structure includes: a first housing component having an opening portion for ventilation; a gas-permeable membrane that is attached to the first housing component to close the opening portion; and a laser welding portion that joins the first housing component with the gas-permeable membrane. The gas-permeable membrane includes a main body including a fluororesin film and a porous resin sheet that is laid on the main body. The porous resin sheet is located on the surface side of the vent structure. Both of the main body and the outer peripheral portion of the porous resin sheet that projects outwardly from the main body are fixed to the first housing component by the laser welding portion.

A vent structure includes: a first housing component having an opening portion for ventilation; a gas-permeable membrane that is attached to the first housing component to close the opening portion; and a laser welding portion that joins the first housing component with the gas-permeable membrane. The gas-permeable membrane includes a main body including a fluororesin film and a porous resin sheet that is laid on the main body. The porous resin sheet is located on the surface side of the vent structure. Both of the main body and the outer peripheral portion of the porous resin sheet that projects outwardly from the main body are fixed to the first housing component by the laser welding portion.