The present invention relates to a plastic composite component (CC) which has a first plastic component (C1) and a second plastic component (C2) and comprises a polyethyleneimine (PEI) for improving the adhesion between C1 and C2. The present invention further relates to a process for producing this plastic composite component (CC), to a process for improving the adhesion between a first plastic component (C1) and a second plastic component (C2) in a plastic composite component (CC) and to the use of polyethyleneimine for improving the adhesion between a first plastic component (C1) and a second plastic component (C2) in a plastic composite component (CC).

A luggage compartment for installation on the fuselage or ceiling in a vehicle, in particular aircraft, comprises at least two side walls which are connectable in load-bearing fashion to a primary structure of the vehicle and which have a fiber composite structure. The fiber composite structure is produced from reinforced curable molding compound and has at least one reinforcement element at least partially embedded therein. The luggage compartment furthermore comprises a shell element which is connected to the side walls and which defines at least a part of a stowage space of the luggage compartment.

A manufacturing method for a multilayer wiring board includes: forming a groove on a surface of a first thermoplastic resin board; forming a modified layer made of resin having a melting point lower than a melting point of resin constituting the first thermoplastic resin board, by applying light to a region of the surface of the first thermoplastic resin board other than a region around the groove; filling the groove of the first thermoplastic resin board with conductive material having fluidity; and bonding a second thermoplastic resin board to the surface of the first thermoplastic resin board, on which the modified layer is formed, by thermocompression bonding.

A manufacturing method for a multilayer wiring board includes: forming a groove on a surface of a first thermoplastic resin board; forming a modified layer made of resin having a melting point lower than a melting point of resin constituting the first thermoplastic resin board, by applying light to a region of the surface of the first thermoplastic resin board other than a region around the groove; filling the groove of the first thermoplastic resin board with conductive material having fluidity; and bonding a second thermoplastic resin board to the surface of the first thermoplastic resin board, on which the modified layer is formed, by thermocompression bonding.

A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380 C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380 C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.