Patent classifications
B29K2995/0013
A Method of Manufacturing An External Breast Prosthesis and Said Prosthesis
A method of manufacturing an external breast prosthesis (12), includes the steps of providing a 3D image of the breast prosthesis, forming the breast prosthesis using an additive manufacturing process, in which additive manufacturing process the breast prosthesis is made by forming a structure of a thermoplastic elastomer, the structure corresponding to the 3D image of the breast prosthesis, wherein the structure is a reticulated solid foam.
FUSED DEPOSITION MODELING BASED MOLD FOR MOLDING, AND REPLICATING OBJECTS, METHOD FOR ITS MANUFACTURE AND FUSED DEPOSITION MODELING 3D PRINTER
The invention provides a method for manufacturing a 3D item (10), wherein the 3D item (10) comprises an outer layer (210) and a support structure (220) with cavities (230), wherein the outer layer (210) at least partly encloses the support structure (220), and wherein the method comprises: (a) a 3D printing stage comprising 3D printing with fused deposition modeling (FDM) 3D printable material (201) the outer layer (210) and the support structure (220) and at least partly filling the cavities (230) with a filler material (204); and (b) a post-treatment stage comprising post treating at least part of the outer layer (210) for reducing surface roughness.
SPEAKER MODULE
The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.
SYSTEMS AND METHODS FOR FORMING SHORT-FIBER FILMS, COMPOSITES COMPRISING THERMOSETS, AND OTHER COMPOSITES
The present disclosure generally relates to systems and methods for composites, including short-fiber films and other composites. In certain aspects, composites comprising a plurality of aligned fibers are provided. The fibers may be substantially aligned, and may be present at relatively high densities within the composite. For example, the composite may include substantially aligned carbon fibers embedded within a thermoplastic substrate. The composites may be prepared, in some aspects, by dispersing fibers by neutralizing the electrostatic interactions between the fibers, for example using aqueous liquids containing the fibers that are able to neutralize the electrostatic interactions that typically occur between the fibers. The liquids may be applied to a substrate, and the fibers may be aligned using techniques such as shear flow and/or magnetism. Other aspects are generally directed to methods of using such composites, kits including such composites, or the like.
Thermally conductive composition, thermally conductive sheet, and method for producing thermally conductive sheet
A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.
COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS
Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.
METHODS AND SYSTEMS FOR INCREASING PRINT SPEED DURING ADDITIVE MANUFACTURING
An additive manufacturing method includes providing a polymeric material and changing a cooling rate of the polymeric material by adding a second material to the polymeric material. The additive manufacturing method also includes providing the polymeric material and the added second material to an additive manufacturing apparatus and depositing the polymeric material, having the changed cooling rate, with the additive manufacturing apparatus at a deposition rate that is based at least in part on the changed cooling rate of the polymeric material.
METHOD FOR FABRICATION OF 3D PRINTED PART WITH HIGH THROUGH-PLANE THERMAL CONDUCTIVITY
A method for fabrication of a 3D printed part with high through-plane thermal conductivity is provided, where pure polymer particles and a carbon-based filler for heat conduction are subjected to milling and mixing in the mechanochemical reactor disclosed in Chinese patent ZL 95111258.9 under the controlled milling conditions including milling pan surface temperature, milling pan pressure, and number of milling cycles; then a resulting mixture is extruded to obtain 3D printing filaments; and finally, the 3D printing filaments are used to fabricate the 3D printed part with high through-plane thermal conductivity through fused deposition modeling (FDM) 3D printing. The fabrication method can realize the fabrication of a 3D printed part with high through-plane thermal conductivity through the FDM 3D printing technology, features simple process, continuous production, etc., and is suitable for the industrial production of thermally-conductive parts with complex structures.
IN-SITU HYDROPHOBICALLY MODIFIED ARAMID NANO AEROGEL FIBER AS WELL AS PREPARATION METHOD AND USES THEREOF
An in-situ hydrophobically modified aramid nano aerogel fiber as well as a preparation method and uses thereof are provided. The preparation method includes: providing an aramid nano spinning solution; preparing a hydrophobically modified aramid nano aerogel fiber by using a spinning technology, wherein the coagulating bath adopted by the spinning technology includes a first organic solvent and a halogenated reagent including a monochloroalkane, a monochloroalkane, a dibromoalkane, a dichloroalkane and a trichloroalkane; and then drying to obtain the in-situ hydrophobically modified aramid nano aerogel fiber. The in-situ hydrophobically modified aramid nano aerogel fiber has a unique three-dimensional porous network structure, low heat conductivity, high porosity, high tensile strength and elongation at break, a certain spinnability and structure stability, and can be applied to the field of textiles. A fabric knitted with the hydrophobic fibers has a self-cleaning ability.
HEAT CONDUCTIVE SHEET AND METHOD FOR PRODUCING SAME
An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.