A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

A method for producing at least one plastic component (1), wherein in the method the following steps, preferably in the following sequence, preferably cyclically in the following sequence, are carried out: a) providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and/or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic polymer; b) applying the at least one sensor film (3) to at least one first region of a surface of the at least one film (2); c) forming the at least one film (2) having the at least one sensor film (3), wherein one or more formed film bodies (4) are made; d) punching out one or more film elements (4a) made from at least one second region of the one or more formed film bodies (4), and a device (10) and a plastic component (1).

An electrical connector with thin interior walls is made by extruding a polymer or polymer composite into a sheet of approximately 0.25 mm to 0.5 mm thickness. The sheet is then calendered to a thickness of about 0.05 mm to 0.3 mm. The calendered sheet is cut into notched sections. The notched sections are assembled and placed into an injection molded housing of a connector. The sections are secured in place by using an adhesive, force fit, snap fit, or welding process to form the thin interior walls of the connector.

A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.

Three-way heating shell, in particular for a motor vehicle fluid circuit, said shell being generally T-shaped or Y-shaped and comprising an inner passage having the same shape, in which passage a three-way fluid connection is intended to be housed, the shell being formed by two half-shells (10a) having the same shape which are attached to one another and together define the passage, the half-shells comprising semi-cylindrical surfaces (22, 24, 26) forming portions of the passage, the heating shell being characterised in that it comprises resistive heating circuits (28a, 28b) which are formed in situ on the semi-cylindrical surfaces.

A method for manufacturing a 3D mechatronic object having predetermined mechatronic functions, which includes as components at least one sensor and/or one actuator, an electronic circuit connected to the sensor and/or to the actuator via electrically conductive tracks, these components positioned in a main mechanical structure, and which consists of multiple polymers having various electronic and/or electroactive properties, comprises the following steps: determining the polymers according to their melting temperature, chemical compatibility, electrical and/or electroactive properties; determining a 3D digital model of the object, including its shape and the routing of the tracks, on the basis of predetermined mechatronic functions of the object, properties of the polymers and specifications of the object; 3D-printing the sensor and/or the actuator, the electronic circuit and the main structure in the same modeling steps according to the generated model by depositing layers of the molten polymers, certain layers being made up of a plurality of polymers, the layers being deposited by means of at least one head dedicated to a base polymer and coupled to a doping mechanism capable of injecting charged particles into the base polymer by interstitial doping so as to obtain the various polymers.

A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

The present invention provides a connection structure and a manufacturing method therefor capable of increasing reliability of a connection part compared to the prior arts. A connection structure according to the present invention includes a plurality of conductive members, a connection part that electrically connects the conductive members, and an electrically insulating molded body in which the connection part is embedded. It is thereby possible to physically reinforce the connection part of the conductive members, keep the connection part in a hermetically sealed condition, thereby prevent corrosion and increase reliability compared to the prior arts.

A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.