Patent classifications
B29L2031/7164
Method and apparatus for heat resistant coatings
A blister pack includes a housing having a plurality of cavities and a cover sealed to the housing and enclosing the cavities. The cover including a base layer, at least one security element, and a heat protective layer. The heat protective layer includes one of an amorphous polymer and a semi-crystalline polymer.
Modified atmosphere packaging machine
Provided is packaging machine with a sealing station that includes a mold with an upper tool and a lower tool facing each other and suitable for cooperating with one another in an operative position of the mold, between which there is delimited an inner area. The lower tool includes a cavity that is configured to receive a tray. A gas injection opening is located adjacent to a first side of the cavity and communicated with the inner area. The upper tool includes a sealing tool and an actuator device facing an actuation region of the lower tool defined between the first side of the cavity and a contact location of the upper and lower tools, and being closer to the lower tool than the sealing tool.
Thermoformable multilayer films and blister packs produced therefrom
A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
THERMOFORMABLE FILM FOR BARRIER PACKAGING AND METHODS OF FORMING THE SAME
In various aspects, the present disclosure pertains to thermoformable, multi-layer polymer films comprising a core layer that is comprised of a blend of high density polyethylene and low density polyethylene and, at least one outermost layer that is comprised of a blend of a cyclic olefin copolymer, polyethylene, a functionalized polymer, a dispersing agent and a mineral filler. The present disclosure includes thermoformed webs made from such films, the webs having one or more thermoformed cavities contained therein. Other aspects of the disclosure pertain to methods of forming such thermoformed webs, packaged products comprising such thermoformed webs, and methods of recycling such thermoformed webs.
Reconfigurable device for dispensing/distributing tablets in blister pockets of a packaging strip of a machine of blister-pack packaging type
Disclosed is a reconfigurable device for dispensing/distributing tablets in the blister pockets of a packaging strip subjected to longitudinal movement in a substantially horizontal plane of a packaging machine having a blister-packer, the reconfigurable device having a frame designed to be mounted on the blister-packer, the frame having a front attachment wall preferably arranged vertically, at least one accessory for dispensing/distributing the tablets in the blister pockets of the strip, the accessory being designed to be mounted removably on the frame. The device includes an intermediate interface intended to be attached removably to the frame, against the front attachment wall thereof, in order to support the at least one accessory. The interface includes at least one drive member of a mobile element of the accessory/accessories supported thereby.
Method of protecting security elements from heat degradation during a heat-sealing process
A blister pack includes a housing having a plurality of cavities and a cover sealed to the housing and enclosing the cavities. The cover includes a base layer, at least one security element, and a heat protection layer. The heat protection layer includes one of an amorphous polymer and a semi-crystalline polymer.
Thermoformed packaging and methods of forming the same
In various aspects, the present disclosure pertains to thermoformed webs that comprise polymer films having one or more thermoformed cavities contained therein, the polymer films comprising a polymer blend of amorphous polyethylene terephthalate (APET) and a copolyester that comprises (a) dicarboxylic acid residues (e.g., dicarboxylic acid residues that comprise terephthalic acid residues and, optionally, one or more additional dicarboxylic acid residues) and (b) diol residues (e.g., diol residues comprising ethylene glycol residues and, optionally, one or more additional diol monomer residues). Other aspects of the disclosure pertain to methods of forming such thermoformed webs, packaged products comprising such thermoformed webs, and methods of recycling such thermoformed webs.
METHOD AND APPARATUS FOR HEAT RESISTANT COATINGS
A blister pack includes a housing having a plurality of cavities and a multi-layer film sealed to the housing and enclosing the cavities, the multi-layer film including a base layer, at least one security element, and a heat protective layer. The heat protective layer is comprised of one of an amorphous polymer material or a semi-crystalline polymer material and is positioned to insulate the at least one security element from heat applied to the heat protective layer during heat sealing of the multi-layer film to the housing, the heat protective layer functioning as a heat sink for protection of the at least one security element during heat sealing of the multi-layer film to the housing.
Sealing supported by pressurized air
A method of closing a packaging tray comprises arranging a packaging tray between a lower tool and an upper tool of a sealing station, positioning a cover film above the packaging tray between the lower tool and the upper tool, and pressing together the cover film and the packaging tray by a lower sealing surface of the lower tool and an upper sealing surface of the upper tool cooperating with the lower sealing surface. During the pressing together, a connection is established between the cover film and the packaging tray along a sealing seam. While the cover film and the packaging tray are being pressed together, an overpressure is locally generated by supplying pressurized gas from a pressurized-gas source, the overpressure cooperating as a counterpressure with the lower sealing surface or with the upper sealing surface so as to press the cover film and the packaging tray together.
THREE-DIMENSIONAL FILM SEALING
Described is an assembly (1) comprising a wall element (2), defining a circumferential bonding strip (3) running over the wall element, and a flexible flat film connected to the bonding strip with a continuous circumferential bonding (4), which wall element and film define two opposite walls (2a, 5a) of a chamber (5), characterized in that the wall element further comprises a base plane B defined by the wall element, at least two corner elements (6a, 6b, 6c, 6d) positioned on a distance to one another, which extend substantially perpendicular with a height H (Ha, Hb, Hc, Hd) in the same direction from the base plane of the wall element, each corner element defining an angle A (Aa, Ab, Ac, Ad) of the chamber with an angle line which is substantially perpendicular to the base plane, strip sections (7a, 7b, 7c, 7d), each connecting two corner elements that define adjacent corners of the chamber to one another, the distance between the strip sections and the base plane being less than H, wherein the continuous circumferential bonding strip runs over the strip sections and over the corner elements and at least in the area of the corner elements at a distance from the base surface corresponding to height H (Ha, Hb, Hc, Hd), and wherein the outer contour of the film is shaped in such a way that the outer contour of the film corresponds to that of the circumferential bonding strip. A method for the production of such an assembly is also described.