Protective clothing materials and related methods and garments are provided. In some embodiments, a protective clothing material may comprise a fibrous layer that serves as a barrier to certain fluids (e.g., bodily fluids, water) and microbes. The impermeability of the fibrous layer may be due, at least in part, to the structural uniformity and/or relatively small pore size of the fibrous layer. In some embodiments, the fibrous layer may have a relatively high air permeability that imparts beneficial properties (e.g., relatively high air flow, breathability) to the protective clothing material without adversely affecting its protection rating. In certain embodiments, the protective clothing material may also comprise one or more coarse nonwoven webs that impart beneficial properties (e.g., splash resistance) to the protective clothing material. The protective clothing materials, described herein, may be particularly useful for a wide variety of applications, including the formation of AAMI level 4 protective garments.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

A mirrored apparatus includes a substrate having a surface and including an additive manufactured aluminum and about 2 to about 30 weight % (wt. %) silicon. The mirrored apparatus also includes a finish layer arranged directly on the surface of the substrate. The finish layer includes a polished surface opposite the substrate. The mirrored apparatus further includes a reflective layer arranged on the polished surface of the finish layer.

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

A method of installing a binder-based overlay system may include contacting a layer of geotextile fabric to a surface of a substrate and applying a primer layer to a surface of the geotextile fabric. Two or more binder layers including infill particles may be applied over the primer layer. A resurfacer layer followed by one or more color layers may be applied over the two or more binder layers. The primer layer, one or more binder layers, resurfacer layer, and two or more color layers may cure upon application to form a monolithic layer upon the substrate.

The Application relates to optically transparent electrostatic transducers. In some embodiments, the transducers comprise graphene. Such transducers are capable of functioning as acoustic sensors and/or transmitters as a singulated device or in an array configuration. Also provided are methods of manufacturing and using such transducers.

An anisotropic thermal interface device including plural aligned thermally anisotropic conductive composite layers. Each layer has a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction. The aligned thermally anisotropic conductive composite layers extend substantially parallel to each other in the first direction and include 45-95 weight percent graphite flakes aligned in the second direction. The thermally anisotropic conductive composite layers have a binder including a branched siloxane. The thermally anisotropic conductive composite layers are adhered to adjacent thermally anisotropic conductive composite. The thermally anisotropic conductive composite layers have a second thermal conductivity of 25 to 45 W/mK. The anisotropic thermal interface device has an arithmetic average surface roughness of 5 to 20 μm and a tensile strength of 50 to 130 KPa.

A preparation process of spunlace intertwining type recycled cow leather comprises a material preparation process, a cow leather fiber web forming process, as well as a mixed fiber web forming process, an overlapped web forming process, a base fabric manufacturing process and a cow leather finished product manufacturing process which are sequentially arranged according to a preparation process flow; the base fabric manufacturing process comprises a buffing process, a single-side immersion treatment process and an ironing process which are sequentially arranged for manufacturing the overlapped web into the base fabric; and the single-side immersion treatment process comprises the steps of subjecting a single side of the base fabric to single-side coating treatment of the water-based PU material or the oil-based PU material by adopting an inverted feeding device and using a water-based PU material or an oil-based PU material as a coating so as to form a single-side permeable immersion layer of the base fabric.

The Application relates to optically transparent electrostatic transducers. In some embodiments, the transducers comprise graphene. Such transducers are capable of functioning as acoustic sensors and/or transmitters as a singulated device or in an array configuration. Also provided are methods of manufacturing and using such transducers.

A wafer has a layer containing silicon, a layer of polycrystalline diamond deposited on the silicon-containing layer, and a bow-compensation layer on the other side of the silicon-containing layer for reducing wafer-bow. A method of making a bonded structure includes an activation process for creating dangling bonds on the surface of one substrate, followed by contact-bonding the surface to a second substrate at low temperature. A bonded structure may include two substrates contact bonded to each other, one substrate including a layer containing silicon, a layer of polycrystalline diamond, a bow-compensation layer for reducing wafer-bow of the first substrate, and the other substrate including gallium nitride, silicon carbide, lithium niobate, lithium tantalate, gallium arsenide, indium phosphide, or another suitable material other than diamond.