The invention relates to a layered material, comprising a substrate and at least one layer A, wherein the at least one layer A comprises at least 50 wt % of a branched copolyester, wherein wt % is with respect to the total weight of layer A, and wherein the branched copolyester has a melting temperature of between 125° C. and 185° C., Mz/Mw of at least 3.5, and having a Melt Flow Index (MFI) of at most 10 g/10 min as measured at 190° C. with 2.16 kg. The invention also relates to a film comprising at least one layer A.

One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m.sup.2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).

The invention provides a sealant film that is less likely to adsorb components formed of various types of organic compounds, has excellent heat sealing characteristics at 140° C., while having low heat sealing strength at 100° C. and being less likely for heat sealing layers to adhere to each other even when the film is used as a packaging bag and the content thereof is warmed in boiling water. The sealant film has at least one heat sealing layer consisting of a polyester component, wherein a heat sealing strength of the heat sealing layer being heat sealed to another heat sealing layer at 100° C. and 0.2 MPa for 2 seconds is 0-5 N/15 mm and at 140° C. and 0.2 MPa for 2 seconds is 8-30 N/15 mm, and a film density including all layers is 1.20 or more and less than 1.39.

The present invention discloses a quantum-dot composite film comprising: a quantum-dot prism film, comprising a quantum-dot layer and a first plurality of prisms disposed over the quantum-dot layer, wherein a first optical prism film and a second optical prism film are disposed over the quantum-dot prism film for increasing the brightness level of the quantum-dot prism film.

A multilayer, heat-shrinkable film generally includes at least one bulk layer and a microlayer section comprising a plurality of microlayers. The film has a sufficiently low shrink force to wrap fragile items, such as furnace filters.

The present invention relates to a reactor-grade copolyester composition having radio-frequency sealing capability. The present invention further relates to films and thermoformable packaging prepared from the reactor-grade copolyester composition and the methods for making such films and articles therefrom.

The present invention provides a polyester film suitable for use as a sealant, which not only has high heat sealing strength, but also is less liable to adsorb various organic compounds, and has a less shrinkage in heating and high tensile strength. Further, the present invention provides a laminate comprising at least one layer of the polyester film, and a packaging bag including the same. The polyester film which is formed with a polyester resin whose main constituent is ethylene terephthalate. The film has at least one heat sealing layer. The film has a predetermined heat sealing strength, a predetermined difference in reversing heat capacity measured with a temperature modulated DSC, and a predetermined heat shrinkage. Further, the laminate comprises at least one layer of the polyester film, and the packaging bag includes the same.

A polyester film and a method for producing the same are provided. The polyester film includes a heat resistant layer. The heat resistant layer includes a high temperature resistant resin material and a polyester resin material. The high temperature resistant resin material and the polyester resin material are melted and kneaded with each other via a twin screw granulator. The twin-screw granulator has a twin-screw temperature between 250° C. and 320° C., and the twin-screw granulator has a twin-screw rotation speed between 300 rpm and 800 rpm, so that the high temperature resistant resin material is dispersed in the polyester resin material with a particle size of between 50 nm and 200 nm.

The invention relates to a film containing a special polycarbonate or copolycarbonate of the formula (Ia), (I-2), (I-3) or (I-4) and to the use of the film in a security document and in a layer structure.

A polyester-based film comprising at least one layer permitting printing as a result of laser irradiation; wherein not less than 100 ppm but not greater than 3000 ppm of laser-printable metal is present in all layers of the film. The film is capable of being printed in distinct fashion by a laser, excels with respect to unevenness in thickness, and is of high transparency, while at the same time provide packaging which employs such film and on which printing has been directly carried out.