Some embodiments of the present disclosure relate to photovoltaic module for use on a roof. In some embodiments, the photovoltaic module may include a solar cell and a polymeric continuous fiber tape. In some embodiments, the polymeric continuous fiber tape comprises a polymer and glass fiber. In some embodiments, the glass fiber is present in an amount greater than about 50% by weight based on a total weight of the polymeric continuous fiber tape. In some embodiments, the polymeric continuous fiber tape comprises an elastic modulus greater than 1 GPa and an optical transmission greater than 80%.

A laminate sheet includes a water-vapor permeable polyurethane film having a hard segment phase and a first spunbond nonwoven fabric disposed at one side in a thickness direction of the water-vapor permeable polyurethane film. The first spunbond nonwoven fabric contains stretchable fibers containing a thermoplastic polyurethane and non-stretchable fibers containing a polyolefin. The melting point of the hard segment phase is 65□ or more and 140□ or less.

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

Processes for forming fiber reinforced composite aircraft components, i.e., aircraft components formed of a cured fiber-reinforced resin, are provided. According to specific embodiments, a finished surface of the composite aircraft component can be achieved by providing in-mold coating of the cured fiber-reinforced resin by a dried and cured film layer of a water-based primer paint material to thereby achieve a composite aircraft component having an exterior surface that does not necessarily require further finishing.

This invention relates to a wind turbine blade component, a method of manufacturing such a wind turbine blade component and a wind turbine blade comprising the wind turbine blade component. The wind turbine blade component comprising a stack of layers arranged in a first group and in a second group, wherein the layers of each group has the same width. The layers of each group is continuously offset in an edgewise direction to form a tapered edge profile. The first group of layers may be arranged relative to the second group, or in an alternating order. The layers of the first group may further have a first length which is greater than a second length of the layers of the second group.

In an aspect of the invention there is provided a blast protection panel, comprising a package of fibre-reinforced resin sheets, each sheet having a dominant unidirectional fibre orientation, said package of fibre-reinforced resin sheets formed in packed stacks, each stack comprising at least four fibre-reinforced resin sheets with dominant unidirectional fibres oriented, within said each stack, alternatingly at about right angles relative to each other; and said each stack packed against adjacent stacks, said adjacent stacks comprising sheets with dominant unidirectional fibres oriented at acute angles relative said each stack thereby forming a delamination interface.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The present invention relates to fiber composite plastic (11, 13) comprising a polymer (40, 41) and at least one textile (50), which has at least one palpably inhomogeneous surface (60, 61) with a textile structure and is entirely surrounded by polymer (40, 41), wherein the fiber composite plastic (11, 13) has at least one palpably inhomogeneous surface (60, 61), wherein inhomogeneities of this fiber composite plastic surface are caused by the textile structure, and a method for producing the fiber composite plastic (11, 13).

A method and system for the characterization of equibiaxial compressive strength in 2D woven composites, such as carbon fiber reinforced laminate composites, is disclosed using induced biaxial flexure, the strain measurements from which are used to determine the equibiaxial compressive strength of the composite.

An object of the present invention is to obtain a fiber-reinforced composite material achieving both lightweight properties and mechanical properties at a high level. The present invention provides a fiber-reinforced composite material including a resin (A) and a reinforcing fiber (B), and having: a porous structure portion having micropores with an average pore diameter of 500 μm or less as measured by a mercury intrusion method; and a coarse cavity portion defined by the porous structure portion and having a maximum length of more than 500 μm as a cross-sectional opening portion.