A laminated glass according to an embodiment of the present invention includes a first glass plate, a second glass plate, and an interlayer film held between the first glass plate and the second glass plate. When a relative dielectric constant of the first glass plate is represented by ε.sub.g1; a relative dielectric constant of the second glass plate is represented by ε.sub.g2; a relative dielectric constant of a first interlayer film provided in a first region of the interlayer film is represented by ε.sub.m1; a reflection coefficient at an interface between the first glass plate and the first interlayer film is represented by Γ.sub.1; and a reflection coefficient at an interface between the second glass plate and the first interlayer film is represented by Γ.sub.2, the reflection coefficients Γ.sub.1 and Γ.sub.2 satisfy relations 0.0≤Γ.sub.1≤0.2 and 0.0≤Γ.sub.2≤0.2.

A ballistic composition, ballistic assembly, and method for fabricating the ballistic assembly. The ballistic composition comprises a curable material, and a particulate component. The particulate component is adapted to impose a tortuous path on a projectile. The particulate component includes polymer, ceramic, metal, or any combination thereof.

Multi-layered articles or products comprising layers of filled polymer compositions, methods of making and applications or uses thereof.

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

Disclosed herein is a method of manufacturing an improved cover board product with a panel. In some embodiments, the method includes preparing fragments into an assembly; mixing the fragments and an adhesive into a blended core furnish; applying the adhesive to a top side of a bottom layer fabric in the assembly; forming a core mat of the blended core furnish on top of the adhesive; applying the adhesive to a top side of the core mat; applying a surface layer fabric on the top side of the adhesive; pressing the assembly; and cutting and trimming the assembly to form panels.

Embodiments disclosed herein relate to composite laminate structures including a polymer layer having sp.sup.2 carbon-containing material and improved heat release properties, and methods of making the same.

Thermoplastic films for packaging having a super-hydrophobic sealant surface (0), flexible packages made therefrom and their use in packaging products, especially food products are described. These packages are characterized by optimal performances, especially in terms of seal strength, recovery of the packaged product and prevention of drip formation.

Disclosed herein is a method of manufacturing an improved cover board product with a panel. In some embodiments, the method includes preparing fragments into an assembly; mixing the fragments and an adhesive into a blended core furnish; applying the adhesive to a top side of a bottom layer fabric in the assembly; forming a core mat of the blended core furnish on top of the adhesive; applying the adhesive to a top side of the core mat; applying a surface layer fabric on the top side of the adhesive; pressing the assembly; and cutting and trimming the assembly to form panels.