Patent classifications
B32B2309/60
METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK
Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.
Acidic gas separation membrane sheet and manufacturing method therefor
An acidic gas separation membrane sheet causes an acidic gas to selectively permeate therethrough. The acidic gas separation membrane sheet includes a first porous layer, a hydrophilic resin composition layer, and a second porous layer in this order. A second peel strength between the second porous layer and the hydrophilic resin composition layer is less than a first peel strength between the first porous layer and the hydrophilic resin composition layer. An average value of the second peel strength is within a range of greater than or equal to 5 N/m and less than or equal to 500 N/m.
Assembly process of two substrates
A method for assembling two substrates by molecular adhesion comprises: a first step (a) of putting first and second substrates in close contact in order to form an assembly having an assembly interface; a second step (b) of reinforcing the degree of adhesion of the assembly beyond a threshold adhesion value at which water is no longer able to diffuse along the assembly interface. The method also comprises a step (c) of anhydrous treatment of the first and second substrates in a treatment atmosphere having a dew point below −10° C., and control of the dew point of a working atmosphere to which the first and second substrates are exposed from the anhydrous treatment step (c) until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the assembly interface.
Substrate bonding apparatus
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.
FLEXIBLE LIDDING FILM
In an embodiment, the invention is directed to a flexible film comprising an outer polymeric layer, an adhesive layer, a metalized polymeric layer, and a sealant layer adjacent the metalized polymeric layer. The flexible film may also comprise a first polymeric layer, an adhesive layer, a second polymeric layer, a barrier layer, and a sealant layer adjacent the barrier layer.
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck above the first bonding chuck in a vertical direction or in a horizontal direction; bonding the first substrate to the second substrate to make a bonded substrate; and wherein, in the bonding the first substrate to the second substrate, injecting a process gas between the first substrate and the second substrate using a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view and injecting an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate using an air curtain generator are performed in combination.
Dental composite blank having multiple layers and method for manufacturing same
Proposed is a method of manufacturing a dental composite blank. The method of manufacturing the dental composite blank includes (a) pressurizing a laminate for a composite blank having multiple layers having different colors at a first pressure (P.sub.1), (b) pressurizing the laminate for a composite blank, pressurized at the first pressure, at a second pressure (P.sub.2), and (c) manufacturing a composite blank by curing the pressurized laminate for a composite blank, in which steps (a) and (b) are each independently performed once or multiple times, and the first pressure (P.sub.1) is less than or greater than the second pressure (P.sub.2), ultimately making it possible to manufacture a dental composite blank that is similar to a natural tooth and thus exhibits a superior aesthetic appearance and high interlayer bonding strength.
DENTAL COMPOSITE BLANK HAVING MULTIPLE LAYERS AND METHOD FOR MANUFACTURING SAME
Proposed is a method of manufacturing a dental composite blank. The method of manufacturing the dental composite blank includes (a) pressurizing a laminate for a composite blank having multiple layers having different colors at a first pressure (P.sub.1), (b) pressurizing the laminate for a composite blank, pressurized at the first pressure, at a second pressure (P.sub.2), and (c) manufacturing a composite blank by curing the pressurized laminate for a composite blank, in which steps (a) and (b) are each independently performed once or multiple times, and the first pressure (P.sub.1) is less than or greater than the second pressure (P.sub.2), ultimately making it possible to manufacture a dental composite blank that is similar to a natural tooth and thus exhibits a superior aesthetic appearance and high interlayer bonding strength.
FLEXIBLE LIDDING FILM
In an embodiment, the invention is directed to a flexible film comprising an outer polymeric layer, an adhesive layer, a metalized polymeric layer, and a sealant layer adjacent the metalized polymeric layer. The flexible film may also comprise a first polymeric layer, an adhesive layer, a second polymeric layer, a barrier layer, and a sealant layer adjacent the barrier layer.
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.