The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

A separation method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied and can easily separate the adherend by applying the voltage again, and a bonding method for an adherend according to the present invention allows members to firmly bond to each other by recovery of adhesive force when a predetermined time elapses after a voltage has been applied.

Interfacial delamination processes for physically separating a film structure from a substrate, and processes of fabricating a thin-film electronic device. The processes entail providing the substrate with an electrically-conductive separation layer on a surface of the substrate and optionally providing a pin hole free barrier layer on the electrically-conductive separation layer, forming a film structure on the electrically-conductive separation layer or, if present, the barrier layer, to yield a multilayer structure, and separating the film structure from the substrate by subjecting the multilayer structure to interfacial debonding that comprises contacting at least an interface between the film structure and the electrically-conductive separation layer or, if present, the barrier layer, with water or an electrolyte solution.

The present invention relates to a unitary absorbent structure and method thereof wherein said unitary absorbent structure comprises an absorbent core (5) and/or an acquisition and dispersion layers (2) (3) and comprising at least one non-woven fibrous substrate layer (23) having a void volume suitable to be penetrated by super absorbent particles. The super absorbent particles are dispersed in the substrate layer (23) according to a size distribution gradient by vacuum (8) and vibration along the depth direction or z-direction of said absorbent core (5) and/or acquisition (2) and dispersion (3) layers, the smaller particles are placed on the bodyside of the absorbent articles and the larger particles are located on the opposite side of the absorbent articles.

A panel for covering and/or soundproofing a wall of a vehicle includes a central layer produced by impregnating a flexible and porous material with a thermoformable resin, then rigidifying the thermoformable resin. The panel also includes two reinforcement layers arranged on either side of the central layer. The impregnation of the flexible and porous material with the thermoformable resin is carried out deep within the flexible and porous material by subjecting a powder of the thermoformable resin to an alternating electric field, the two reinforcement layers being made of a flexible or semi-rigid material.

The present invention relates to a unitary absorbent structure and method thereof wherein said unitary absorbent structure comprises an absorbent core (5) and/or an acquisition (2) and dispersion (3) layer, said absorbent core (5) and/or an acquisition (2) and dispersion (3) layer comprising at least one non-woven fibrous substrate layer (23) having a void volume suitable to be penetrated by super absorbent particles, characterized in that said super absorbent particles are dispersed in the substrate layer (23) according to a size distribution gradient along the depth direction or z-direction of said absorbent core (5) and/or acquisition (2) and dispersion (3) layers.

A cap has a cavity for accommodating a light-emitting element and includes a front wall defining a front surface of the cavity and made of a material that transmits light emitted from the light-emitting element; a rear wall defining a rear surface of the cavity and located opposite to the front wall; and a main body defining an upper surface and a lateral surface of the cavity and joined with the front wall and the rear wall. A lower end surface of each of the front wall, the rear wall, and the main body defines a bonding surface of the cap, and the main body includes a plurality of portions layered between the rear wall and the front wall.

A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm.sup.3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,

TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.(Numerical Formula 11)

TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)10 degrees C.(Numerical Formula 12).

Sizing agent coated carbon fibers obtained by coating carbon fibers with a sizing agent comprising at least one of (A) to (C) in a total amount of 80 mass % or more with respect to the whole sizing agent, the carbon fibers each having a surface layer which has a thickness of 10 nm or larger and has an oxygen content of 4% or higher with respect to all the elements, wherein when the sizing agent coated carbon fibers are subjected three times to a 10-minute ultrasonic treatment in an acetone solvent, then the amount of the remaining sizing agent is 0.1-0.25 parts by mass per 100 parts by mass of the sizing agent coated carbon fibers. (A) At least one polymer selected from the group consisting of polyimides, polyetherimides, and polysulfones (B) A compound having a terminal unsaturated group and a polar group in the molecule (C) A polyether-type aliphatic epoxy compound and/or a polyol-type aliphatic epoxy compound which each have an epoxy equivalent of 250 g/eq or less and have two or more epoxy groups in the molecule

A panel for covering and/or soundproofing a wall of a vehicle includes a central layer produced by impregnating a flexible and porous material with a thermoformable resin, then rigidifying the thermoformable resin. The panel also includes two reinforcement layers arranged on either side of the central layer. The impregnation of the flexible and porous material with the thermoformable resin is carried out deep within the flexible and porous material by subjecting a powder of the thermoformable resin to an alternating electric field, the two reinforcement layers being made of a flexible or semi-rigid material.