A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-α-olefin copolymer (B), and a metal inactivating agent (C).

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

High-performance metal matrix composites of copper, aluminum, and/or titanium are produced by embedding nanocarbon reinforcement into metal foil or sheet which is concurrently laminated into a multilayer structure to produce high- performance materials for thermal management, enhanced electrical conductivity, armor products and high-strength composite structures.

A multilayer protective covering can protect a surface from lightning strikes. The covering includes a bottom conductive layer affixed to the surface and having a first opening that is aligned with a grounding connection so that the grounding connection is exposed through first opening and not in contact with the bottom conductive layer. The covering also includes a dielectric layer affixed to the bottom conductive layer and having second opening aligned with the grounding connection so that the grounding connection is exposed through second opening and not in contact with the dielectric layer. The covering additionally includes a top conductive layer affixed to the dielectric layer and covering the grounding connection. The top conductive layer directs electrical current from a lightning strike on the surface to the grounding connection.

A carbon fiber reinforced plastic structure has a low surface roughness and has reduced deformation due to residual stress, changes in temperature, etc., and a processing apparatus that uses the structure, are disclosed. The carbon fiber reinforced plastic structure (CFRP structure) includes a carbon fiber reinforced plastic member (CFRP member), and a resin layer formed on a first surface of the carbon fiber reinforced plastic member, the resin layer including an opposite surface that is opposite to a surface facing the first surface, the opposite surface having a surface roughness that is less than a surface roughness of the first surface of the carbon fiber reinforced plastic member.