A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

A spandrel including a first substrate, an intermediate film made of polymer material, and a second, opaque substrate, such that the first substrate is coated with at most two layers which are deposited on the surface located on the side facing the intermediate film made of polymer material and which include at least one upper dielectric layer.

Methods are described that include contacting an alkyl ammonium metal halide film with an alkyl ammonium halide, where the alkyl ammonium metal halide film includes a first halogen and a metal, the alkyl ammonium halide includes a second halogen, such that the contacting forms an alkyl ammonium metal mixed-halide film that interfaces with the alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film includes the first halogen, the second halogen, and the metal.

A method for producing polymer coated steel sheet for 3-piece cans and 3-piece cans produced thereof.

An electromagnetic interference shielding film includes an insulation layer, a first adhesive layer, a porous metal layer and a conductive adhesive layer including a plurality of conductive particles. The first adhesive layer is located between the insulation layer and the porous metal layer, and the porous metal layer is formed on the first adhesive layer, and making the first adhesive layer locate between the porous metal layer and the insulation layer. The conductive adhesive layer is located on the porous metal layer so that the porous metal layer is located between the first adhesive layer and the conductive adhesive layer. The present invention further provides a preparation method thereof.

A coated article includes a substrate with a first surface and a second surface and a functional coating applied over the surface. The functional coating includes a base layer over at least a portion of the substrate; a metallic layer over at least a portion of the base layer; and a top layer over at least a portion of the metallic layer. The base layer includes a first film of tin oxide over at least a portion of the substrate and a second film covering the entire portion of the first film. Methods of making a coated article, reducing scattering center formation, and reducing red haze formation are also provided.

Object: Provided is a decorative vapor deposition sheet that can reduce or prevent a defect, such as the breaking of a metal vapor deposition layer or the entire sheet, even when applied to a forming method requiring high temperature or the like. The decorative vapor deposition sheet of an embodiment of the present disclosure is a decorative vapor deposition sheet including a cover resin layer and a metal vapor deposition layer, in which the cover resin layer has a thickness of approximately 50 micrometers or greater, the metal vapor deposition layer exhibits a granular structure, a breaking elongation of the decorative vapor deposition sheet at 20° C. is approximately 120% or greater, and a breaking elongation of the decorative vapor deposition sheet at 160° C. is approximately 350% or greater.

The present invention concerns a laminated glass, comprising first and second glass sheets and a ply of interlayer material therebetween; a heating element arranged on a surface of the second glass sheet adjacent the ply of interlayer material; a circumference of the heating element spaced from an edge of the second glass sheet forming a circumferential region between the circumference and the edge of the second glass sheet where conductive material of the heating element has been at least partly removed; a conductive ring configured in the circumferential region spaced from the circumference and spaced from the edge of the second glass sheet and electrically isolated from the heating element wherein conductive materials of the heating element and the conductive ring are different.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu.sub.6Sn.sub.5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 μm to 0.6 μm (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).