The invention relates to a cover structure the SMC main body of which is simultaneously pressed and bonded with two additional layers in a bonding press.

It is an object of the invention to provide a heat-resistant vacuum insulation panel having two heat-resistant protective layers to improve fire protection, in particular at locations of the vacuum insulation panel subject to mechanical stress.

A method for producing a film for a composite pane of a motor vehicle, which film serves as an intermediate layer of the composite pane, comprising the following steps: providing a polyvinyl butyral (PVB) film base material or an ethylene vinyl acetate copolymer (EVA) film base material; providing at least one colorant; mixing the PVB or EVA film base material with the at least one colorant; liquefying the mixture of the PVB or EVA film base material and the at least one colorant; extruding the film from the liquefied mixture of the PVB or EVA film base material and the at least one colorant; treating the extruded film section by section by irradiating the film in order to form sections of different light transmissivity.

A method for producing a mica paper honeycomb may include providing sheets of partially cured impregnated mica paper, and gluing the sheets along periodic parallel lines to form an unexpanded, partially cured mica paper honeycomb. The unexpanded partially cured mica paper honeycomb may be expanded to obtain an expanded partially cured mica paper honeycomb. The expanded partially cured mica paper honeycomb may be cured to obtain a mica paper honeycomb.

The invention provides a package film, manufacturing method thereof, and packaging method for OLED panel. The package film comprises a polymer substrate, at least two organic buffer layers, and at least two inorganic barrier layers; with a single layer of the organic buffer layer and a single layer of the inorganic barrier layer being alternately stacked on the polymer substrate; the inorganic barrier layer formed with one or more materials from graphene film, mica sheet film, and carbon nanotube film to achieve a package film with transmittance, high barrier, and high flexibility, reduces the device oxygen permeability and reduce the package film thickness, make the device thinner, and meet the packaging requirements for flexible OLED panel; moreover, by disposing water absorption layer and water barrier layer in organic buffer layer at periphery to enhance the package film structure from lateral side to further improve water and oxygen barrier ability.

The present disclosure relates to insulation. Teachings thereof may be embodied in a solid insulation material, especially in tape form, the use thereof in a vacuum impregnation process and to an insulation system produced therewith, and also an electrical machine comprising the insulation system, especially for the medium- and high-voltage sector, namely for medium- and high-voltage machines, especially rotating electrical machines in the medium- and high-voltage sector, and to semifinished products for electrical switchgear. For example a solid insulation material with an anhydride-free impregnating agent may include: a carrier; a barrier material; a curing catalyst; and a tape adhesive. The curing catalyst and the tape adhesive are inert toward one another but react under the conditions of a vacuum impregnation process if combined with an anhydride-free impregnating agent having gelation times of 1 h to 15 h at impregnation temperature. The tape adhesive is free of oxirane groups and includes at least two free hydroxyl groups.

Various embodiments may include a solid insulation material, e.g. in tape form, the use thereof in a vacuum impregnation process, and/or an insulation system produced therewith and also an electrical machine having the insulation system, for the medium- and high-voltage sector. Some examples include rotating electrical machines in the medium- and high-voltage sector and also semifinished products for electrical switchgear. The solid insulation material and the insulation system produced therewith are characterized in that it can be produced in an anhydride-free manner, wherein the curing catalyst is, for example, an adduct of a 1H-imidazole and/or 1H-imidazole derivative with a compound containing oxirane groups.

An insulative assembly includes an insulative mica-based carrier film and first and second resistive grading layers joined to opposite sides of the mica-based carrier film. The first resistive material layer is configured to engage one or more conductors and insulate the one or more conductors from at least one other conductor. A method for creating an insulative assembly for one or more conductors includes obtaining an insulative mica-based carrier film, depositing a first resistive grading layer on a first side of the mica-based carrier film, and depositing a second resistive grading layer on an opposite, second first side of the mica-based carrier film.

A gas barrier film includes a first base material film made of a plastic material and a coating layer formed on one of surfaces of the first base material film, the coating layer contains a watersoluble polymer and a water-swelling mica, the solid content ratios of the water-swelling mica in 5 a total solid content of the coating layer are within approximate ranges indicated from 20 mass % to 50 mass %, the mean area diameter of the water-swelling mica is within approximate ranges indicated from 0.5 m to 5 m, and the thickness of the coating layer is within approximate ranges indicated from 0.1 m to 1 m.

An insulative assembly includes an insulative mica-based carrier film and first and second resistive grading layers joined to opposite sides of the mica-based carrier film. The first resistive material layer is configured to engage one or more conductors and insulate the one or more conductors from at least one other conductor. A method for creating an insulative assembly for one or more conductors includes obtaining an insulative mica-based carrier film, depositing a first resistive grading layer on a first side of the mica-based carrier film, and depositing a second resistive grading layer on an opposite, second first side of the mica-based carrier film.