The invention relates to a method for manufacture of a product or in completion of a product. A flexible mat (20) is manufactured from an incompletely cured thermo-setting plastic, wherein the mat comprises an article (10) of electrically conductive material. The incompletely cured mat (20) including the article (10) is then formed as a function of a forming tool or to lie against or for contact with a product, whereafter final curing of the mat (20) is executed by supplying electric power to the article (10) or by external heat application or ultraviolet light. The invention also relates to an arrangement and uses.

One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.

The present invention provides a fiber-reinforced resin which has excellent tensile shear joining strength and is able to be integrated with another structural member with high productivity by means of thermal welding, thereby being suitable as a structural material. The present invention is a fiber-reinforced resin which contains constituents (A), (B) and (C), while having a multilayer structure that is composed of a thermosetting resin layer that is formed of (B) a thermosetting resin, a thermoplastic resin layer that is formed of (C) a thermoplastic resin, and a mixed layer that is present between the thermoplastic resin layer and the thermosetting resin layer, while being obtained by mixing the thermoplastic resin (C) and the thermosetting resin (B), in such a manner that the thermoplastic resin layer is present in the surface. With respect to this fiber-reinforced resin, at least some of (A) reinforcing fibers are present in the mixed layer. (A) Reinforcing fibers (B) Thermosetting resin (C) Thermoplastic resin

The invention relates to a bamboo floor, in particular to a composite bamboo floor. The composite bamboo floor comprises a floor surface board provided with a body, a pressed surface, a connecting surface connected with the core board, at least one cut surface board side face and surface board end faces, and the core board arranged under the floor surface board and provided with a core board surface connected with the floor surface board, a core board bottom surface, core board side faces and core board end faces, and the positions of the core board side faces or the core board side faces and the surface board side faces are provided with notch structures processed in two sides in the length direction of the composite bamboo floor. The composite bamboo floor is high in strength, high in processing efficiency and low in production cost.

A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.

Provided is a laminate film having excellent bonding properties, resistance to water whitening, and chemical resistance, and containing a fluororesin layer comprising a fluororesin composition, and an acrylic resin layer comprising a resin composition that contains a reactive group-containing acrylic resin, acrylic rubber particles, and a thermoplastic resin.

Methods and apparatus to vent gas and vapor from a panel via venting channels for a decorative layer are disclosed. An example apparatus includes a decorative layer, an adhesive layer to couple the decorative layer to a panel, and a resin layer disposed between the decorative layer and the adhesive layer. The adhesive layer is coupled to a first side of the resin layer. The decorative layer is coupled to a second side of the resin layer. The first side of the resin layer defines venting channels to vent at least one of gas or vapor away from the decorative layer to deter the at least one of gas or vapor from exerting a pressure on the decorative layer to deter separation of a portion of the decorative layer from the resin layer. The venting channels have a depth to impede the adhesive layer from filling the venting channels.

Provided is a complex material that includes a first metal deposition layer, a first thermosetting resin layer positioned on one side of the first metal deposition layer, and a second thermosetting resin layer positioned on the other side of the first metal deposition layer.

A honeycomb core construction that includes at least two honeycomb cores and a connection layer that is disposed between the honeycomb cores. The connection layer is configured so as to be gas-permeable, and has an adhesive for adhesively bonding to the honeycomb cores only in a region of the webs of the honeycomb cores.

Manufacturing a semiconductor apparatus includes preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant, heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer, and cutting the encapsulated substrate or wafer by dicing. Coating includes surrounding a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant together with the substrate or the wafer.