A sheet processing device separates a two-ply sheet in which two sheets are overlapped and partially bonded and sandwich a sheet medium between the two sheets. The sheet processing device includes a relay conveyance path, a sheet loader, and control circuitry. The sheet medium is fed from an image forming apparatus connected upstream of the sheet processing device through the relay conveyance path. The sheet loader loads at least one of the two-ply sheet and the sheet medium. The control circuitry performs a mixing mode to feed the two-ply sheet or the sheet medium from the sheet loader.

Improved BIPV materials configured to meet various long-term requirements including, among others, a high degree of water resistance, physical durability, electrical durability, and an ability to withstand variations in temperature and other environmental conditions. In some embodiments, the disclosed BIPV materials include modules wherein two or more layers of the module are configured to be joined together during lamination to protect edge portions of the top sheet and/or back sheet of the module, such as in the vicinity of any multi-layer vapor barrier structure(s) of the module.

An overlay applicator can include an overlay with a top side and a bottom side. The bottom side can include an adhesive agent configured to adhere to a screen of an electronic device. The overlay applicator can include an adhesive release liner. The adhesive release liner can include a top side and a bottom side. The top side of the adhesive release liner can be removably attached to the bottom side of the overlay. The adhesive release liner can be configured to protect the adhesive agent at the bottom side of the overlay from contaminants. The overlay applicator can include a protective film removably attached to the top side of the overlay. The overlay applicator can include an alignment tab. The alignment tab can include an alignment mechanism. The overlay applicator further can include a pull tab. The pull can include a wiper. Other embodiments are provided.

A sheet processing device separates a two-ply sheet in which two sheets are overlapped and partially bonded and sandwich a sheet medium between the two sheets. The sheet processing device includes a relay conveyance path, a sheet loader, and control circuitry. The sheet medium is fed from an image forming apparatus connected upstream of the sheet processing device through the relay conveyance path. The sheet loader loads at least one of the two-ply sheet and the sheet medium. The control circuitry performs a mixing mode to feed the two-ply sheet or the sheet medium from the sheet loader.

Snowboards are constructed by initial manufacture of a base sub-assembly including fewer than all layers of the snowboard, e.g., a base layer, edges, and a stabilizing layer. These layers are permanently bonded together into a unitary base sub-assembly. The running (bottom) surface is then finished to provide a desired surface consistency by eliminating undesired irregularities from the manufacturing process, e.g., using a conventional base grinding machine. Subsequently, the base sub-assembly and remaining snowboard layers (e.g., top sheet and a core sandwiched between reinforcing layers) are permanently bonded together into a unitary final snowboard assembly, which may then be worked to form a finished snowboard. Snowboards may be either flat or non-flat in both the longitudinal and transverse directions. Accordingly, the method may be used to produce snowboards having a desired sanded/ground base surface having a desired surface consistency, even for snowboards that are non-flat in the transverse direction.

Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermediate laminate.

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): ##STR00001##
and a diamine of Formula (2) or (3): ##STR00002##
wherein G, P, R, R.sub.x, P, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

A substructure and its method of use eliminates core crush during the manufacturing of a hybrid sandwich-structured composite panel. The substructure is used in the manufacturing of the hybrid sandwich-structured composite panel by positioning a core of the composite panel in a cavity of the substructure and positioning the substructure and the core between layers of composite material where the substructure protects the core from core crush as the hybrid sandwich-structured composite panel is subjected to vacuum pressure and heat during autoclaving and then cured.

An apparatus for applying security elements, comprises at least one value document substrate transport device for transporting a value document substrate web, at least one security elements transport device for transporting a security elements carrier band having a plurality of security elements, wherein the security elements carrier band has a first and a second main surface which oppose each other, each security element has a first and a second main surface which oppose each other, each security element is arranged with its first main surface on the first main surface of the security elements carrier band, and each security element has adhesive properties at its second main surface, wherein the apparatus has an application region in order to apply the security elements with their second main surface onto the value document substrate web. A security elements carrier band and a value document involve the apparatus.