Patent classifications
B32B37/26
SUBSTRATE-CONVEYING SUPPORT TAPE AND ELECTRONIC APPARATUS/DEVICE PRODUCTION METHOD
A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.
SUBSTRATE-CONVEYING SUPPORT TAPE AND ELECTRONIC APPARATUS/DEVICE PRODUCTION METHOD
A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.
TRANSFER FILM, TRANSPARENT LAMINATE, METHOD FOR PRODUCING TRANSPARENT LAMINATE, CAPACITIVE INPUT DEVICE, AND IMAGE DISPLAY DEVICE
A transfer film has a temporary support, a first curable transparent resin layer, a second curable transparent resin layer in which the thickness of the first curable transparent resin layer is equal to or greater than 1 μm, the second curable transparent resin layer includes 5% by mass to 95% by mass of a metal oxide particle with respect to the solid content of the second curable transparent resin layer, and the first curable transparent resin layer does not include the metal oxide particle, or includes less amount of the metal oxide particle than the second curable transparent resin layer.
TRANSFER FILM, TRANSPARENT LAMINATE, METHOD FOR PRODUCING TRANSPARENT LAMINATE, CAPACITIVE INPUT DEVICE, AND IMAGE DISPLAY DEVICE
A transfer film has a temporary support, a first curable transparent resin layer, a second curable transparent resin layer in which the thickness of the first curable transparent resin layer is equal to or greater than 1 μm, the second curable transparent resin layer includes 5% by mass to 95% by mass of a metal oxide particle with respect to the solid content of the second curable transparent resin layer, and the first curable transparent resin layer does not include the metal oxide particle, or includes less amount of the metal oxide particle than the second curable transparent resin layer.
LAMINATE PRODUCTION METHOD
To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.
FILM PASTING ASSEMBLY AND ASSEMBLING METHOD
The present disclosure relates to a film pasting assembly which comprises a base film provided with an annular first adhesive layer and a second adhesive layer, a first release film comprising a first annular portion and a first handle portion for arranging on the first adhesive layer, and a second release film comprising a second annular portion and a second handle portion for arranging on the second adhesive layer. The inner circumference of the first annular portion is equal to the outer circumference of the second annular portion. The first release film and the second release film may be torn apart respectively for product pasting. The success rate, efficiency of product assembly and yield of products may be improved. The first release film and the second release film may be processed by a same raw material for cost saving.
FILM PASTING ASSEMBLY AND ASSEMBLING METHOD
The present disclosure relates to a film pasting assembly which comprises a base film provided with an annular first adhesive layer and a second adhesive layer, a first release film comprising a first annular portion and a first handle portion for arranging on the first adhesive layer, and a second release film comprising a second annular portion and a second handle portion for arranging on the second adhesive layer. The inner circumference of the first annular portion is equal to the outer circumference of the second annular portion. The first release film and the second release film may be torn apart respectively for product pasting. The success rate, efficiency of product assembly and yield of products may be improved. The first release film and the second release film may be processed by a same raw material for cost saving.
Dissolvable adhesive liner label and methods of making and using same
A duplex label. The duplex label has a first face ply having a printable upper side and a lower side, and a second face ply having an upper side and a printable lower side. A layer of patterned adhesive is situated underneath the lower side of the first face ply. A displaceable liner coating comprising an enabler, a facilitator, and a stabilizer is formulated, and the layer of patterned adhesive is covered with the displaceable liner coating. The displaceable liner coating is activated by bringing the displaceable liner coating in contact with a fluid. The second face ply is secured to the first face ply using the activated displaceable liner coating such that the printable upper side faces away from the printable lower side. The first face ply is secured to the substrate, and the second face ply is sandwiched between the first face ply and the substrate.
Dissolvable adhesive liner label and methods of making and using same
A duplex label. The duplex label has a first face ply having a printable upper side and a lower side, and a second face ply having an upper side and a printable lower side. A layer of patterned adhesive is situated underneath the lower side of the first face ply. A displaceable liner coating comprising an enabler, a facilitator, and a stabilizer is formulated, and the layer of patterned adhesive is covered with the displaceable liner coating. The displaceable liner coating is activated by bringing the displaceable liner coating in contact with a fluid. The second face ply is secured to the first face ply using the activated displaceable liner coating such that the printable upper side faces away from the printable lower side. The first face ply is secured to the substrate, and the second face ply is sandwiched between the first face ply and the substrate.
Diode Devices Based on Superconductivity
An electronic device (e.g., a diode) is provided that includes a substrate and a patterned layer of superconducting material disposed over the substrate. The patterned layer forms a first electrode, a second electrode, and a loop coupling the first electrode with the second electrode by a first channel and a second channel. The first channel and the second channel have different minimum widths. For a range of current magnitudes, when a magnetic field is applied to the patterned layer of superconducting material, the conductance from the first electrode to the second electrode is greater than the conductance from the second electrode to the first electrode.