In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

The present invention relates to a continuous printing apparatus using a vacuum suction roller, and it is to provide a continuous printing apparatus and method using a vacuum suction roller capable of reducing costs and improving productivity by continuously printing on the surface of a woven fabric using the vacuum suction roller.

Provided herein are methods and systems for the custom-printing of an item including, e.g., a) accepting customer request data for a workpiece and customer request data for a graphic design to cover at least a portion of the workpiece; b) accepting workpiece identifier data from a workpiece database based on the customer request data; c) accepting print design data from a print design database based on the customer request data for a graphic design; d) associating the print design data with the workpiece identifier data; e) printing the print design data onto a hydrofilm portion; f) placing the hydrofilm portion onto a fluid surface in a dip tank; g) applying an activator to the hydrofilm portion to yield an activated hydrofilm portion; and h) dipping the workpiece into the dip tank, whereby the activated hydrofilm portion is bonded to the workpiece as a result of the dipping.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

An illustrative dye sublimation apparatus may include a texture sheet with a pattern to be applied to a substrate. More specifically, the texture sheet is pressed into the substrate during the dye sublimation process in order to apply the pattern from the texture sheet while the substrate is heated and simultaneously being infused with an image from a printed sheet. The pressure applied to the texture sheet can vary, for example based on the temperature. Compared to the conventional systems in which substrates are pre-textured, the embodiments disclosed herein describe a process for simultaneous image-infusion and texture-application, which results in a substrate that is both infused and textured.

The present invention relates to a continuous printing apparatus using a vacuum suction roller, and it is to provide a continuous printing apparatus and method using a vacuum suction roller capable of reducing costs and improving productivity by continuously printing on the surface of a woven fabric using the vacuum suction roller.