An element substrate according to an embodiment of the present invention includes a plurality of print elements and a plurality of drive elements for driving the plurality of print elements. The element substrate comprises a generation circuit configured to generate a first drive signal that drives drive elements belonging to a first group among the plurality of drive elements, and a second drive signal that drives drive elements belonging to a second group among the plurality of drive elements, using a selector configured to switch a signal transmitted from outside of the element substrate and an output destination of the signal within one block period in driving the plurality of drive elements by dividing the plurality of elements into the plurality of blocks. The first drive signal and the second drive signal are generated at different timings.

An apparatus includes a reservoir and a printhead. The printhead includes a support structure including a deformable portion defining at least a top surface of a pumping chamber, a flow path extending from the reservoir to the pumping chamber to transfer fluid from the reservoir to the pumping chamber, and an actuator disposed on the deformable portion of the support structure. A trench is defined in a top surface of the actuator. Application of a voltage to the actuator causes the actuator to deform along the trench, thereby causing deformation of the deformable portion of the support structure to eject a drop of fluid from the pumping chamber.

An apparatus includes a reservoir and a printhead. The printhead includes a support structure including a deformable portion defining at least a top surface of a pumping chamber, a flow path extending from the reservoir to the pumping chamber to transfer fluid from the reservoir to the pumping chamber, and an actuator disposed on the deformable portion of the support structure. A trench is defined in a top surface of the actuator. Application of a voltage to the actuator causes the actuator to deform along the trench, thereby causing deformation of the deformable portion of the support structure to eject a drop of fluid from the pumping chamber.

An element substrate according to an embodiment of the present invention includes a plurality of print elements and a plurality of drive elements for driving the plurality of print elements. The element substrate comprises a generation circuit configured to generate a first drive signal that drives drive elements belonging to a first group among the plurality of drive elements, and a second drive signal that drives drive elements belonging to a second group among the plurality of drive elements, using a selector configured to switch a signal transmitted from outside of the element substrate and an output destination of the signal within one block period in driving the plurality of drive elements by dividing the plurality of elements into the plurality of blocks. The first drive signal and the second drive signal are generated at different timings.

In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

An integrated circuit to drive a plurality of fluid actuation devices includes a configuration register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface and a data interface. The control logic enables writing to the configuration register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface.

An apparatus includes a reservoir and a printhead. The printhead includes a support structure including a deformable portion defining at least a top surface of a pumping chamber, a flow path extending from the reservoir to the pumping chamber to transfer fluid from the reservoir to the pumping chamber, and an actuator disposed on the deformable portion of the support structure. A trench is defined in a top surface of the actuator. Application of a voltage to the actuator causes the actuator to deform along the trench, thereby causing deformation of the deformable portion of the support structure to eject a drop of fluid from the pumping chamber.

An integrated circuit to drive a plurality of fluid actuation devices includes a status register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface, a data interface, and a fire interface. The control logic enables reading of the status register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface, and transitioning a signal on the fire interface to logic high with the signal on the single data interface floating.

In some examples, a fluid dispensing device component includes an input to receive a control signal from the fluid dispensing system, the control signal for activating the fluidic actuators of the fluid dispensing device during a fluidic operation mode. The fluid dispensing device component includes a nonvolatile memory, and a controller to, during a memory write mode, write a first portion of the nonvolatile memory to a first programmed level responsive to the control signal being activated for a first time duration, and write a second portion of the nonvolatile memory to a second programmed level responsive to the control signal being activated for a second time duration different from the first time duration, the second programmed level being different from the first programmed level.

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.