Patent classifications
B41J2/055
Liquid ejecting head and liquid ejecting apparatus
A liquid ejecting head includes nozzles configured to eject liquid, pressure chambers communicating with the nozzles, the pressure chambers being configured to generate pressure for ejecting the liquid, a first liquid chamber configured to store the liquid to be supplied to the pressure chambers, a second liquid chamber configured to store the liquid that passed through the pressure chambers, first communication paths communicating with the pressure chambers from the first liquid chamber, second communication paths respectively communicating with the second liquid chamber from between the pressure chambers and the nozzles in which flow path resistance in the first communication paths is higher than flow path resistance in the second communication paths.
Liquid ejecting head and liquid ejecting apparatus
A liquid ejecting head includes nozzles configured to eject liquid, pressure chambers communicating with the nozzles, the pressure chambers being configured to generate pressure for ejecting the liquid, a first liquid chamber configured to store the liquid to be supplied to the pressure chambers, a second liquid chamber configured to store the liquid that passed through the pressure chambers, first communication paths communicating with the pressure chambers from the first liquid chamber, second communication paths respectively communicating with the second liquid chamber from between the pressure chambers and the nozzles in which flow path resistance in the first communication paths is higher than flow path resistance in the second communication paths.
Liquid ejection head, and liquid ejection device
A liquid ejection head that includes ejection orifices and is configured by bonding a silicon substrate and a support substrate, flow passages which penetrate a bonding surface between the silicon substrate and the support substrate and through which different types of liquids flow. An in-partition wall space that is open to the bonding surface between the silicon substrate and the support substrate is formed in a partition wall for separating the flow passages. The internal pressure of the in-partition wall space is set to be lower than pressure of the liquid on each of the flow passages.
Fluid ejection devices with reduced crosstalk
A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.
Fluid ejection devices with reduced crosstalk
A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.
FLUID EJECTION DEVICES WITH REDUCED CROSSTALK
A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.
FLUID EJECTION DEVICES WITH REDUCED CROSSTALK
A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.
INKJET PRINT HEAD WITH CONTINUOUS FLOW AND PRESSURE PULSE DAMPENING
An inkjet print head includes a plurality of droplet jetting devices. The plurality of droplet jetting devices is formed of a nozzle layer defining, for each of the plurality of droplet jetting devices, a nozzle, a membrane layer carrying, on a membrane, a restrictor layer and an actuator for generating pressure waves in a liquid in a pressure chamber that is connected to the nozzle. The actuator is positioned in an actuator chamber in the restrictor layer, and a distribution layer defining a supply line for supplying the liquid to the pressure chamber. The restrictor layer includes an inlet restrictor having a cross-section and an outlet restrictor positioned on opposites sides of the actuator and having a cross-section that is different from the cross-section of the inlet restrictor.
Low cost damper
A damper for a continuous ink jet printer, comprising a fluid receiving chamber (6), comprising at least a lateral wall (22), a fluid inlet (11), and a fluid outlet (12), and at least one membrane (14), the membrane being in a material having a Young modulus between 0.5 MPa and 1000 MPa, the membrane being deformed under the influence of a pressure variation in the first portion.
Low cost damper
A damper for a continuous ink jet printer, comprising a fluid receiving chamber (6), comprising at least a lateral wall (22), a fluid inlet (11), and a fluid outlet (12), and at least one membrane (14), the membrane being in a material having a Young modulus between 0.5 MPa and 1000 MPa, the membrane being deformed under the influence of a pressure variation in the first portion.