One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

A liquid circulating device has: a supply flow path through which a liquid is supplied from a liquid supply source that stores the liquid to a liquid ejecting head that ejects the liquid; a collection flow path through which the liquid collected from the liquid ejecting head is returned to the supply flow path; and a liquid flowing portion that causes the liquid to flow in a circulation flow path including the supply flow path, the liquid ejecting head, and the collection flow path. An air capturing portion can capture bubbles and is provided in at least one of the supply flow path and collection flow path. The air capturing portion is disposed at a position higher than the position of the liquid ejecting head.

An example device includes a droplet ejector including a nozzle to eject droplets of a fluid and a target medium to receive the droplets of the fluid. The target medium is separated from the droplet ejector by a gap to be traversed by the droplets. The example device further includes a frame affixing the target medium to the droplet ejector. The target medium is immovably held with respect to the droplet ejector.

A liquid ejecting head includes: multiple head chips; a first board that is a rigid board coupled to multiple flexible boards mounted on the respective head chips; and a second board that is disposed opposite the head chips with the first board therebetween and that is a rigid board provided with a connector. The first board has a first and second board-to-board connectors; the second board has a third and fourth board-to-board connectors. The first board-to-board connector mates with the third board-to-board connector so that the first board-to-board connector is coupled to the third board-to-board connector. The second board-to-board connector mates with the fourth board-to-board connector so that the second board-to-board connector is coupled to the fourth board-to-board connector. The connector is electrically coupled to both the third and fourth board-to-board connectors.

An element substrate, according to an embodiment of this present invention, capable of detecting the behavior of a liquid at a high sensitivity, comprises: a first electrothermal transducer configured to generate heat to discharge a liquid; at least one temperature detection element arranged near the first electrothermal transducer; and a second electrothermal transducer configured to generate heat in association with a temperature detection operation by the at least one temperature detection element.

A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones. A nozzle plate in formed on the channel layer by forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones.

An inkjet nozzle device includes: a bubble chamber having a heating element for generating a vapour bubble and an orifice positioned for communicating an impulse from the vapour bubble; a first inlet for supplying a first fluid to the bubble chamber; an ejection chamber having a roof defining a nozzle and an adjoining wall between the ejection chamber and the bubble chamber, the adjoining wall defining the orifice; and a second inlet for supplying a second fluid to the ejection chamber. In use, the first and second fluids form a fluidic interface at the orifice and the vapour bubble provides the impulse to the second fluid in the ejection chamber via the orifice, such that the impulse ejects the second fluid from the nozzle.

An inkjet printhead includes a two-dimensional array of drop ejectors arranged as a plurality of columns, each column including a plurality of banks, and each bank including a plurality of groups that each include a plurality of drop ejectors. The drop ejectors in each group are substantially aligned along a first direction. The groups in each bank are spaced from each other along the first direction and are offset from each other along a second direction. The banks in each column are spaced from each other along the first direction and are offset from each other along the second direction. The columns are offset from each other along the second direction. The two-dimensional array has a width W along the first direction and a length L greater than W along the second direction. Each drop ejector includes a nozzle, an ink inlet, a pressure chamber and an actuator

A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.