The head chip includes an actuator plate having ejection channels and non-ejection channels extending in a Y direction and arranged alternately in an X direction, an intermediate plate overlapped with the actuator plate in a Z direction, and provided with communication holes communicated with the ejection channels and through holes communicated with the non-ejection channels, and a nozzle plate overlapped with the intermediate plate in the Z direction in a state of closing the through holes, and provided with nozzle holes which are communicated with the communication holes, jet liquid contained in the ejection channels, and are formed at positions corresponding to the ejection channels. The non-ejection channels are communicated with an outside of the head chip. The through holes are each disposed at an inner side in the X direction of the inner surfaces extending in the Y direction of the non-ejection channel viewed from the Z direction.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

In order to provide an inkjet head using an adhesive containing an epoxy resin as a main agent and an imidazole-based curing agent as a curing agent, capable of securing a time for joining work before curing, and having excellent long-term reliability, and a production method for the inkjet head, constituent members are bonded to each other by an adhesive containing at least an epoxy resin as a main agent, a microencapsulated imidazole-based curing agent as a curing agent, and an alcohol that dissolves the microcapsules at a low temperature, and preferably, a residue of the microcapsules dissolved by the alcohol is dispersed in the cured epoxy resin.

Disclosed is a method of manufacturing, a metal nozzle plate, in which is formed a nozzle for discharging a liquid and that is to be bonded with adhesive to a head chip provided with an actuator for discharging the liquid, the method including: forming the nozzle in a metal plate-like member; forming a groove in the metal plate-like member; and performing exterior processing with respect to the nozzle plate.

A method for producing a liquid transport apparatus is disclosed. The liquid transport apparatus includes a pressure chamber plate, a ceramics layer formed on a surface of the pressure chamber plate, a piezoelectric layer formed on the ceramics layer, and an electrode formed on the piezoelectric layer. The ceramics layer is formed by heating an insulating ceramic material at a temperature lower than an annealing temperature of the piezoelectric layer. Accordingly, the atoms of the pressure chamber plate are suppressed from being diffused into the piezoelectric layer.

A liquid discharge head includes a base plate, a cavity plate located on the base plate and including a cavity, and a piezoelectric actuator substrate located on the cavity plate. The cavity plate includes: a first groove located inside a contact region with the piezoelectric actuator substrate and configured to release an adhesive for bonding the cavity plate and the piezoelectric actuator substrate; and a second groove located in a manner to surround the contact region with the piezoelectric actuator substrate and configured to release the adhesive. The base plate includes a third groove configured to open the first groove to the atmosphere. The third groove is configured to communicate between the first groove and the outside through a first hole communicating with the first groove and a second hole located outside the contact region of the cavity plate and the piezoelectric actuator substrate.

A head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring the tolerance of the displacement between nozzle holes and communication holes while ensuring the bonding area between an actuator plate and an intermediate plate are provided. The head chip according to an aspect of the present disclosure includes an actuator plate, a nozzle plate disposed so as to be opposed to the actuator plate, and an intermediate plate disposed between the actuator plate and the nozzle plate. The communication holes each include a groove part having a lower-side opening part opening toward the nozzle hole, and a penetrating part having an upper-side opening part opening toward an ejection channel. A dimension in the X direction in the upper-side opening part is larger than a dimension in the X direction in the upper-side opening part, and a dimension in the X direction in the upper-side opening part is no larger than a dimension in the X direction of the channel opening part opening on a channel opening surface of the ejection channel.

A head chip prevented from deteriorating in printing quality is provided. The head chip is provided with an intermediate plate which has a plurality of columns of communication hole groups for each channel column, the communication hole group having communication holes individually communicated with ejection channels of an actuator plate and arranged in a line in an X direction. The communication holes adjacent to each other in the X direction are arranged so as to be shifted in a Y direction from each other. The intermediate plate is provided with a non-penetrating groove closed by a nozzle plate, and a penetrating hole communicated with the non-penetrating groove, and communicated with an outside of the head chip through a non-ejection channel. A part of the non-penetrating groove is located in an inter-communication hole region. A minimum gap in the X direction between an opening edge of the communication hole and the non-penetrating groove in the inter-communication hole region is larger than a minimum gap in the X direction between the opening edge of the communication hole and the non-ejection channel.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of homogenously forming protective films on inner surfaces of channels while dealing with miniaturization of the channels and a decrease in pitch of the channels. The head chip according to an aspect of the present disclosure includes an actuator plate having a plurality of ejection channels arranged, a common electrode formed on an inner surface of the ejection channel, a first protective film disposed so as to cover the common electrode on the inner surface of the ejection channel, an intermediate plate which has ejecting communication holes and ejection-side introduction ports respectively communicated with the plurality of ejection channels, and which is disposed so as to face a channel opening surface on which the ejection channels open in the actuator plate, and a nozzle plate which has a plurality of nozzle holes configured to eject ink, and which is disposed at an opposite side to the actuator plate with respect to the intermediate plate in a state in which the ejecting communication holes are respectively communicated with the nozzle holes, and the ejection-side introduction ports are closed.