In a liquid ejection head in which ejection modules are arrayed on a flow path forming member, each ejection module includes a recording element substrate provided on a support member. The recording element substrate includes a liquid supply channel, a liquid collection channel, and ejection ports. The support member includes supply-side liquid communication ports communicating with the liquid supply channel and collection-side liquid communication ports communicating with the liquid collection channel. The supply-side liquid communication ports and the collection-side liquid communication ports are alternately provided along the direction in which the ejection modules are arrayed. The closest pair of liquid communication ports in the adjacent ends of two adjacent ejection modules are both supply-side or collection-side liquid communication ports.

A liquid ejecting apparatus includes a liquid ejecting head that ejects liquid, supplied from a liquid supplier, toward a medium, an mounting portion on which the liquid supplier is removably mounted, and a supply channel that supplies the liquid from the mounting portion to the liquid ejecting head. The mounting portion has a frame forming an accommodating space capable of accommodating the liquid supplier, and the supply channel includes a portion disposed along the frame.

A liquid ejecting apparatus includes a liquid ejecting head that ejects a liquid supplied from a liquid supplier which has an engaging portion, a container that has an engaging-portion-receiving portion with which the engaging portion engages, and an attaching portion to which the container is detachably attached. The liquid supplier is detachably attached to the attaching portion with movement of the container in a state where the engaging portion has engaged with the engaging-portion-receiving portion. The engaging portion engages with the engaging-portion-receiving portion to be relatively movable in a direction which crosses a movement path of the container when the container is attached to the attaching portion.

In a liquid ejection head in which ejection modules are arrayed on a flow path forming member, each ejection module includes a recording element substrate provided on a support member. The recording element substrate includes a liquid supply channel, a liquid collection channel, and ejection ports. The support member includes supply-side liquid communication ports communicating with the liquid supply channel and collection-side liquid communication ports communicating with the liquid collection channel. The supply-side liquid communication ports and the collection-side liquid communication ports are alternately provided along the direction in which the ejection modules are arrayed. The closest pair of liquid communication ports in the adjacent ends of two adjacent ejection modules are both supply-side or collection-side liquid communication ports.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.

A liquid ejecting apparatus includes a liquid ejecting head that ejects a liquid supplied from a liquid supplier which has an engaging portion, a container that has an engaging-portion-receiving portion with which the engaging portion engages, and an attaching portion to which the container is detachably attached. The liquid supplier is detachably attached to the attaching portion with movement of the container in a state where the engaging portion has engaged with the engaging-portion-receiving portion. The engaging portion engages with the engaging-portion-receiving portion to be relatively movable in a direction which crosses a movement path of the container when the container is attached to the attaching portion.