An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

A system for sensing element adjustment and material belt detection comprises a machine body, adjustable clamping device, material disk and sensing system. The adjustable clamping device being configured on a material belt of said machine body, an adjustable plate being configured on an adjusting element of a main body of the adjustable clamping device, and an adjustable rod being configured on the adjustable plate allow forming a triangle pivot support with two fixing rods of the main body. Furthermore, an elastic element is configured between the adjustable plate and main body to allow the adjustable plate to drive the adjustable rod to achieve an elastic adjustment support in such a way to allow the mounting of the material disks of different hole diameters through the adjustable rod. Furthermore, a material belt detection device of the present invention may detect the material belt stably and effectively.

A system for sensing element adjustment and material belt detection comprises a machine body, adjustable clamping device, material disk and sensing system. The adjustable clamping device being configured on a material belt of said machine body, an adjustable plate being configured on an adjusting element of a main body of the adjustable clamping device, and an adjustable rod being configured on the adjustable plate allow forming a triangle pivot support with two fixing rods of the main body. Furthermore, an elastic element is configured between the adjustable plate and main body to allow the adjustable plate to drive the adjustable rod to achieve an elastic adjustment support in such a way to allow the mounting of the material disks of different hole diameters through the adjustable rod. Furthermore, a material belt detection device of the present invention may detect the material belt stably and effectively.