B81B2201/02

Microelectromechanical system (MEMS) scanner having a torsional beam flexure with variable width

A microelectromechanical systems (MEMS) scanning device comprising a torsional beam flexure that has a variable width in relation to a rotational axis for a scanning mirror. The geometric properties of the torsional beam vary along the rotational axis to increase a desired mode of mechanical strain at a location where a strain sensor is operating within the MEMS scanning device to generate a feedback signal. The torsional beam flexure mechanically suspends the scanning mirror from a frame structure. During operation of the MEMS scanning device, actuators induce torsional deformation into the torsional beam flexure to cause rotation of the scanning mirror about the rotational axis. The degree or amount of this torsional deformation is directly related to the angular position of the scanning mirror and, therefore, the desired mode of mechanical strain may be this torsional deformation strain component.

Method for communicating with implant devices

Disclosed is a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to communicate wirelessly with an implant device associated with a proprietary system provided by a first entity. An external device, that may not be associated with said first entity, is provided and is configured to be calibrated to communicate with the implant device that is located within a patient. The external device may be used in place of an existing reader device that was initially calibrated to communicate with the implant device prior to the implant device being placed within the patient. The external device may be particularly useful for implant devices that communicate wirelessly with external devices where said implant devices are intended to be located within the human body on a permanent or indefinite duration of time.

SENSOR OUTPUT DIGITIZER
20220333957 · 2022-10-20 ·

The described technology is generally directed towards a sensor output digitizer. The sensor output digitizer can comprise a multiplexer stage, a multi-stage analog to digital converter, and a digital output combiner. The multiplexer stage can be configured to sequentially select sensor outputs from one or more sensors, resulting in a stream of selected sensor outputs. The multi-stage analog to digital converter can be coupled with the multiplexer stage, and can be configured to convert the stream of selected sensor outputs into a stream of digitized outputs. The digital output combiner can be configured to re-scale and sum intermediate outputs of the multi-stage analog to digital converter to produce a stream of digitized sensor outputs.

SENSING MODULE

A sensing module including a circuit substrate, a sensing element, a packaging material and a blocking structure is provided. The sensing element, the packaging material and the blocking structure are disposed on the circuit substrate. The sensing element comprises a sensing portion. The outer side surface of the blocking structure is in direction contact with the packaging material to define a boundary of the packaging material. The sensing portion is disposed in a region encircled by the boundary of the packaging material, and the maximum thickness of the packaging material from a surface facing away from the circuit substrate to the circuit substrate is less than or equal to a distance from the second surface of the blocking structure to the circuit substrate.

Overload recovery optimization in microelectromechanical system application specific integrated circuit
11661334 · 2023-05-30 · ·

Disclosed herein is a MEMS ASIC. In some examples, the MEMS ASIC can include a MEMS, an analog front end (AFE) amplifier, an analog-to-digital converter (ADC), an overload detector, and a high-ohmic (HO) block. The HO block and the MEMS can form a high-pass filter (HPF). The impedance of the HO block can be related to the DC operating level of the AFE amplifier and the cutoff frequency of the HPF. In some examples, an overload event can occur, and the overload detector can be configured to adjust the impedance of the HO block to reduce the settling time of the MEMS ASIC. Methods of using the MEMS ASIC to reduce the settling time of the MEMS ASIC due to an overload event are disclosed herein.

WIRELESS SENSOR READER ASSEMBLY

Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.

SENSOR DEVICE AND RELATED METHOD AND SYSTEM

The sensor is configured to provide a digital output signal and has a digital detector, which is configured to detect a physical quantity and generate a conditioned digital signal indicative of the detected physical quantity; and a rate modification stage, configured to receive the conditioned digital signal and a group of parameters, the group of parameters comprising an interpolation factor and a downsampling factor, and to provide the digital output signal. The rate modification stage has an interpolator and a decimation element. The interpolator is configured to receive and to upsample the conditioned digital signal based on the interpolation factor and to provide an interpolated signal. The decimation element is configured to downsample the interpolated signal based on the downsampling factor, thereby generating the digital output signal.

Device, system, method, and computer product for detecting and evaluating environmental quantities and events with modular approach and variable complexity

A system for detecting and evaluating environmental quantities and events is formed by a detection and evaluation device and a mobile phone, connected through a wireless connection. The device is enclosed in a containment casing housing a support carrying a plurality of inertial sensors and environmental sensors. A processing unit is coupled to the inertial sensors and to the environmental sensors. A wireless connection unit, is coupled to the processing unit and a wired connection port, is coupled to the processing unit. A programming connector is coupled to the processing unit and is configured to couple to an external programming unit to receive programming instructions of the processing unit. A storage structure is coupled to the processing unit and a power-supply unit supplied power in the detection and evaluation device. The mobile phone stores an application, which enables a basicuse mode, an expert use mode, and an advanced use mode.

ADAPTER WITH EMBEDDED FILTER COMPONENTS FOR SENSORS

A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including—a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface,—wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.

3D MEMS MAGNETOMETER AND ASSOCIATED METHODS
20170363694 · 2017-12-21 ·

A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.