MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. An actuator coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

Methods, apparatuses, and methods of manufacture are described that provide one or more fixed blades mounted to a frame or substrate, one or more movable blades mounted to each structure to be moved, and flexures on which the structures are suspended which reduces moment of inertia during use.

An optical circuit switch device and method for using the device are provided. The device may include a fiber array including a set of optical fibers configured for transmitting optical signals. The device may include a collimator array coupled to the fiber array configured for aligning the optical signals received from the fiber array. The device may include a first mirror array for receiving the optical signals from the collimator array. The device may include a second mirror array for receiving the optical signals from the first mirror array. The device may include a lens located at the fiber array, the lens having a focal point at the second mirror array.

An actuator device includes a support part, a first movable part, and a second movable part. The second movable part includes a pair of first connection portions positioned on both sides of the first movable part on a first axis and connected to a pair of first connecting parts, and a pair of second connection portions positioned on both sides of the first movable part on a second axis and connected to a pair of second connecting parts. Each of the second connection portions includes a portion having a width larger than a width of a portion of the second movable part other than the first and second connection portions. An inner edge of each of the second connection portions, includes a depression recessed in a second axis direction, and an outer edge of each of the pair of second connection portions, includes a protrusion protruding in the second axis direction.

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

An actuator device includes a support part, a first movable part, and a second movable part. The second movable part includes a pair of first connection portions positioned on both sides of the first movable part on a first axis and connected to a pair of first connecting parts, and a pair of second connection portions positioned on both sides of the first movable part on a second axis and connected to a pair of second connecting parts. An outer edge of each of the pair of the first connection portions includes a first linear portion that extends along a second axis direction. An outer edge of each of the pair of the second connection portions includes a second linear portion that extends along a first axis direction.

Embodiments of the application provide a MEMS chip and an electrical packaging method for a MEMS chip. The MEMS chip includes a MEMS device layer, a first isolating layer located under the MEMS device layer, and a first conducting layer located under the first isolating layer. At the first isolating layer, there are a corresponding quantity of first conductive through holes in locations corresponding to conductive structures in a first region and in locations corresponding to electrodes in a second region. At the first conducting layer, there are M electrodes spaced apart from one another, and the M electrodes are respectively connected to M of the first conductive through holes. At the first conducting layer, electrodes in locations corresponding to at least some of the conductive structures in the first region are electrically connected in a one-to-one correspondence to electrodes in locations corresponding to at least some of the electrodes in the second region.

For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

A method for controlling a drive apparatus (20) of a micro-oscillation mirror (16), a control device (28) and a deflector mirror apparatus (14) are described. The drive apparatus (20) has at least two comb drives (22a, 22b) which are arranged on different radial sides of a pivoting axis (18) of the micro-oscillation mirror (16). In the method, at least two actuation signals AS1, AS2) are generated, and the at least two comb drives (22a, 22b) are therefore actuated at least temporarily in such a way that they drive the micro-oscillation mirror (16) in an oscillating fashion. At least one elongation signal (P1, P2), which characterizes the elongation (26) of the micro-oscillation mirror (16) is generated using at least one comb drive (22a, 22b). At least one of the actuation signals (AS1, AS2) is adapted to the oscillation of the micro-oscillation mirror (16) on the basis of at least one of the elongation signals (P1, P2), At least one of the comb drives (22a, 22b) is connected, by means of at least one switching apparatus (34), alternately to an actuation apparatus (32) for receiving at least one actuation signal (AS1, AS2) or to an elongation-detection apparatus (24) for generating at least one elongation signal (P1, P2).