A temperature sensor is a temperature sensor using a MEMS resonator, and includes: a MEMS resonator; a sweeper that sweeps a frequency of an excitation signal for a vibrator of the MEMS resonator in a predetermined sweep direction, and outputs the excitation signal swept to the MEMS resonator; a discontinuity point detector that obtains a vibration state information signal, which is a characteristic quantity expressing a vibration state of the vibrator based on the excitation signal, from the MEMS resonator, and detects a detection value that is (i) a frequency of the excitation signal when the vibration state information signal obtained changes discontinuously or (ii) a time corresponding to the frequency; and a converter that determines a physical quantity acting on the MEMS resonator based on the detection value detected.

A method for forming a MEMS device includes following operations. A first semiconductor layer is formed over a substrate. A plurality of first pillars are formed over the first layer. A second layer is formed over the first pillars and the first layer. A plurality of second pillars are formed over the second layer. A third layer is formed over the second pillars and the second layer.

Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

A method for producing a bonding pad for a micromechanical sensor element. The method includes: depositing a first metal layer onto a top face of the functional layer, and depositing a second metal layer onto the first metal layer, wherein only the first layer or only the second layer is formed in a border region extending around a bonding pad region; covering a protective layer over a top face of the second metal layer in the bonding pad region and over the first or second metal layer in an inner peripheral portion of the border region, which inner peripheral portion adjoins the bonding pad region; etching the first or second layer at least in an outer peripheral portion of the border region down to the top face of the functional layer; removing the protective layer; carrying out an etching process starting from the top face of the layered structure.

Provided herein is a hierarchical superhydrophobic surface comprising an array of first geometrical features disposed on a substrate comprising a first material and a terminal level disposed on the second features, wherein the terminal level comprises a second material, the second material being different from the first material. The second material has a hydrophilicity different from the hydrophilicity of at least one of 1) the hydrophilicity of the second material and 2) hydrophilicity induced by the hierarchical structure. The present disclosure further includes methods of preparing hierarchical superhydrophobic surfaces and medical devices comprising the hierarchical superhydrophobic surfaces.

Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.

A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.