B81B2203/056

DEVICE AND METHOD FOR QUASI-RESONANT-MODE VOLTAGE CONTROL OF A SWITCHING CONVERTER
20180004240 · 2018-01-04 ·

A control device for controlling a switching converter includes a switch controller that generates a control signal with a switching period for controlling switching of a switch of the switching converter and setting a first interval in which a current flows in the switch, a second interval in which energy is transferred onto a storage element of the switching converter, and a third, wait, interval, at the end of the second interval. The duration of the first interval is determined based on a control voltage indicating the output voltage. A pre-distortion stage receives the control voltage and generates a pre-distorted control voltage as a function of the control voltage and a relationship between one of the first and third time intervals and the switching period, wherein the switch controller is configured to control a duration of the first interval based on the pre-distorted control voltage.

MICRO-ELECTRO-MECHANICAL DEVICE HAVING A TILTABLE STRUCTURE, WITH DETECTION OF THE POSITION OF THE TILTABLE STRUCTURE
20180003950 · 2018-01-04 ·

A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

Method for manufacturing a plurality of resonators in a wafer

A method for manufacturing a plurality of mechanical resonators (100) in a manufacturing wafer (10), the resonators being intended to be fitted to an adjusting member of a timepiece, the method comprising the following steps: (a) manufacturing a plurality of resonators in at least one reference wafer according to reference specifications, such manufacture comprising at least one lithography step to form patterns of the resonators on or above the reference wafer and a step of machining in the reference plate using the patterns; (b) for the at least one reference plate, establishing a map indicative of the dispersion of stiffnesses of the resonators relative to an average stiffness value; (c) dividing the map into fields and determining a correction to be made to the dimensions of the resonators for at least one of the fields in order to reduce the dispersion; (d) modifying the reference specifications for the lithography step so as to make the corrections to the dimensions for the at least one field in the lithography step; (e) manufacturing resonators in a manufacturing wafer using the modified specifications.

Multidirectional translating and tilting platform using bending actuators as active entity

A platform includes first and second actuation layers. The first actuation layer includes first and second frames and a plurality of actuators connected between the first frame and the second frame, wherein the plurality of actuators are adapted to move the first and second frames with respect to each other in a first direction. The second actuation layer includes third and fourth frames and a plurality of actuators connected between the third frame and the fourth frame, wherein the plurality of actuators are adapted to move the third frame and the fourth frame with respect to each other in a second direction, different from the first direction. Thereby, the fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other, such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

MEMS transducer

A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

MEMS TRANSDUCER

A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

MEMS inertial sensor with high resilience to the phenomenon of stiction

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass along a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary and one secondary stopper elements. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

MICRO SCANNING MIRROR

A micro scanning mirror, including a fixed substrate, a lens, and multiple cantilevers, are provided. Each cantilever includes a piezoelectric material structure, multiple first drive electrodes, and multiple second drive electrodes. The piezoelectric material structure includes a connecting part, a folding part, and a fixed part. The connecting part connects the lens along a direction parallel to a central axis of the lens. The folding part has a bending region and multiple drive electrode regions. The fixed part is connected to the fixed substrate, and the folding part is connected to the connecting part and the fixed part. The first drive electrodes and the second drive electrodes are respectively located in the corresponding drive electrode regions in the folding part. The micro scanning mirror of the disclosure can drive a large-sized micro mirror to rotate at an appropriate rotation angle.

METHOD FOR MANUFACTURING A PLURALITY OF RESONATORS IN A WAFER

A method for manufacturing a plurality of mechanical resonators (100) in a manufacturing wafer (10), the resonators being intended to be fitted to an adjusting member of a timepiece, the method comprising the following steps: (a) manufacturing a plurality of resonators in at least one reference wafer according to reference specifications, such manufacture comprising at least one lithography step to form patterns of the resonators on or above the reference wafer and a step of machining in the reference plate using the patterns; (b) for the at least one reference plate, establishing a map indicative of the dispersion of stiffnesses of the resonators relative to an average stiffness value; (c) dividing the map into fields and determining a correction to be made to the dimensions of the resonators for at least one of the fields in order to reduce the dispersion; (d) modifying the reference specifications for the lithography step so as to make the corrections to the dimensions for the at least one field in the lithography step; (e) manufacturing resonators in a manufacturing wafer using the modified specifications.

METHOD OF ASSEMBLING MOBILE MICRO-MACHINES AND A MOBILE MICRO-MACHINE
20220340414 · 2022-10-27 ·

The invention relates to a method of assembling mobile micro-machines comprising a main body and at least one actuating element, wherein the method comprises the steps of defining a 3D-shape of elements of the mobile micro-machines, the elements comprising components such as the main body and/or the at least one actuating element; fabricating said elements, said step of fabrication comprising at least the fabrication of the main body, the main body comprising one or more edges; and assembling said mobile micro-machines by applying an external electric field, wherein said external electric field forms electric field gradients at said one or more edges and wherein said gradients attract said actuating element so that the main body and the at least one actuating element self-assemble into a micro-machine at said one or more edges. The invention further relates to a mobile micro-machine.