An apparatus comprising an array of polymer-based capacitive micromachined ultrasonic transducers positioned on a substrate. The substrate may be at least substantially transparent to ionizing radiation, be flexible, and/or have walls positioned thereon to protect the transducers.

A method for manufacturing a plurality of mechanical resonators (100) in a manufacturing wafer (10), the resonators being intended to be fitted to an adjusting member of a timepiece, the method comprising the following steps: (a) manufacturing a plurality of resonators in at least one reference wafer according to reference specifications, such manufacture comprising at least one lithography step to form patterns of the resonators on or above the reference wafer and a step of machining in the reference plate using the patterns; (b) for the at least one reference plate, establishing a map indicative of the dispersion of stiffnesses of the resonators relative to an average stiffness value; (c) dividing the map into fields and determining a correction to be made to the dimensions of the resonators for at least one of the fields in order to reduce the dispersion; (d) modifying the reference specifications for the lithography step so as to make the corrections to the dimensions for the at least one field in the lithography step; (e) manufacturing resonators in a manufacturing wafer using the modified specifications.

An optical scanning system includes one or more Micro-Electro-Mechanical System (MEMS) Micro-Mirror Arrays (MMAs) used to scan a field-of-view (FOV) over a field-of-regard (FOR). The MEMS MMA is configured such that optical radiation from each point in the FOV does not land on or originate from out-of-phase mirror segments and a diffraction limited resolution of the optical system is limited by the size of the entrance pupil and not by the size of individual mirrors.

Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A plurality of cavities are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a plurality of movable membranes, and where the movable membranes overlie the cavities, respectively. A plurality of fluid communication channels are disposed in the dielectric structure, where each of the fluid communication channels extend laterally between two neighboring cavities of the cavities, such that each of the cavities are in fluid communication with one another.

A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.

A piezoelectric micromachined ultrasonic transducer (PMUT) includes a substrate, a stopper, and a membrane, where the substrate and the stopper are composed of same single-crystalline material. The substrate has a cavity penetrating the substrate, and the stopper protrudes from a top surface of the substrate and surrounds the edge of the cavity. The membrane is disposed over the cavity and attached to the stopper.

A sensor comprising a support and a flexible structure arranged on the support is provided. The flexible structure comprises a frustum-shaped portion having a wider end and a narrower end, wherein the wider end of the frustum-shaped portion is arranged proximal to the support, and an elongated portion extending from the narrower end of the frustum-shaped portion, wherein the flexible structure further comprises a stretchable conducting film arranged on the frustum-shaped portion. A method of preparing such a sensor is also provided.

A method for manufacturing a plurality of mechanical resonators (100) in a manufacturing wafer (10), the resonators being intended to be fitted to an adjusting member of a timepiece, the method comprising the following steps: (a) manufacturing a plurality of resonators in at least one reference wafer according to reference specifications, such manufacture comprising at least one lithography step to form patterns of the resonators on or above the reference wafer and a step of machining in the reference plate using the patterns; (b) for the at least one reference plate, establishing a map indicative of the dispersion of stiffnesses of the resonators relative to an average stiffness value; (c) dividing the map into fields and determining a correction to be made to the dimensions of the resonators for at least one of the fields in order to reduce the dispersion; (d) modifying the reference specifications for the lithography step so as to make the corrections to the dimensions for the at least one field in the lithography step; (e) manufacturing resonators in a manufacturing wafer using the modified specifications.

An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

Micro-electro-mechanical systems and a preparation method thereof are provided. The micro-electro-mechanical systems include first fixed comb fingers, second fixed comb fingers, a support beam, a movable platform, and movable comb fingers. The first fixed comb fingers and the second fixed comb fingers are fastened to a substrate, and the first fixed comb fingers are electrically isolated from the second fixed comb fingers. Two ends of the support beam are fastened to the substrate, and the movable platform is coupled to the support beam. The movable comb fingers are coupled to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers. This structure improves drive efficiency of the micro-electro-mechanical systems.