A temporary MEMS-based locking assembly is configured to temporarily compress electrically conductive flexures and includes: a first locking structure coupled to a first portion of a MEMS conductive assembly; a second locking structure coupled to a second portion of the MEMS conductive assembly, wherein: the electrically conductive flexures are positioned between the first portion of the MEMS conductive assembly and the second portion of the MEMS conductive assembly, and the first and second locking structures are configured to engage each other upon the compression of the electrically conductive flexures to effectuate the locking of the first portion of the MEMS conductive assembly with respect to the second portion of the MEMS conductive assembly.

The devices and systems described herein generally relate to programmable surfaces. A set of tiles in conjunction with actuators, allow for the surface to be constantly changeable from a first shape to an unlimited variety of second shapes. Once a desired second shape is achieved, the shape can be held by actuating the actuators. The system can include detection and maintenance of the shapes of the programmable surface by controlling which of the actuators are released and when they are released.

A microstructured surface is disclosed capable of immobilizing or resisting displacement forces with respect to a target surface. The microstructured surface is capable of generating capillary bridges with a target surface. The capillary bridges can be further stabilized to generate a novel liquid enhanced adhesion mechanism.

The present invention relates to the fields of physics, material sciences and micro and nano electronics, and concerns a method for producing a rolled-up electrical or electronic component, as can be used for example as a capacitor, or in aerials. The object of the present invention is to provide a low-cost, environmentally friendly and time-saving method for producing a rolled-up electrical or electronic component with many windings. The object is achieved by a method for producing a rolled-up component in which at least two functional and insulating layers, alternately arranged fully or partially over one another, are applied to a substrate with a sacrificial layer, wherein at least the functional or insulating layer that is arranged directly on the sacrificial layer has a perforation, at least on the two sides that are arranged substantially parallel to the rolling direction.

The present invention disclosed a micro acoustic collector with a lateral cavity, comprising: a base metal layer; a movable film, an annular side wall; a lateral metal layer. The movable film faces towards the base metal layer to form a hollow space. The lateral metal layer is formed at a side of the movable film and around the movable film, fixed by the annular side wall and spaced apart from peripheral of the movable film by a distance, and the lateral metal layer faces towards the base metal layer to form a lateral cavity to assist an acoustic collection.

An optical device formed of a mirror wafer, a cap wafer, and a glass wafer. The mirror wafer includes a first layer of electrically conductive material, a second layer of electrically conductive material, and a third layer of electrically insulating material between the first layer and the second layer. A mirror element is formed of the second layer of the mirror wafer, and has a reflective surface in the bottom of a cavity opened into at least the first layer. A good optical quality planar glass wafer can be used to enclose the mirror element when the mirror wafer, cap wafer, and glass wafer are bonded to each other.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.

An angular velocity acquisition device includes a movable body, a drive electrode to which a drive voltage is applied to vibrate the movable body in a first direction, at least one stopper that stops the movable body at a predetermined position, a hold electrode which receives a hold voltage to hold the movable body at the predetermined position, a detection unit that detects a predetermined physical quantity depending on an amplitude of the vibration of the movable body in a second direction based on a Coriolis force acting on the movable body that vibrates in the first direction, and an angular velocity calculation unit that calculates an angular velocity of the movable body based on the predetermined physical quantity detected by the detection unit.

A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.

A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.