A laminated structure includes a frame body having a first surface and a second surface facing in mutually opposite directions in a thickness direction, the frame body including a film body supported by the frame body and a hollow portion opening at the second surface and being located between the film body and the second surface; and a lid body attached to the frame body, including cavity located on the film body and an opening which communicates with the cavity and being formed at a positon at which at least a part of the film body is exposed to an external space of the laminated structure. The lid body includes a groove portion formed in a surface (a back surface) of the lid body facing the frame body, and the cavity and the external space of the laminated structure communicate with each other through the groove portion.

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

Tunable MEMS etalon devices comprising: a front mirror and a back mirror, the front and back mirrors separated in an initial pre-stressed un-actuated etalon state by a gap having a pre-stressed un-actuated gap size determined by a back stopper structure in physical contact with the front mirror and back mirrors, the etalon configured to assume at least one actuated state in which the gap has an actuated gap size gap greater than the pre-stressed un-actuated gap size; an anchor structure, a frame structure fixedly coupled to the front mirror at a first surface thereof that faces incoming light, and a flexure structure attached to the anchor structure and to the frame structure but not attached to the front mirror, and a spacer structure separating the anchor structure from the back mirror, and wherein the front mirror and the spacer structure are formed in a same single glass layer.

The present disclosure relates to a transducer assembly including a transducer having a movable member, and a servo-loop controller configured to compensate for effects of a disturbance on the transducer assembly by adjusting a bias voltage applied to the transducer. A servo-loop controller having a smaller bandwidth for out-of-band disturbances than for in-band disturbances and configured to control the bias voltage based on a feedback signal generated by a sensor that detects an effect of the disturbance on the transducer assembly. The transducer assembly can be implemented as a microphone or a speaker among other sensors and actuators.

A digital micromirror device comprises an array of micromirror pixels, the array comprising a first micromirror pixel and a second micromirror pixel. The first micromirror pixel comprises a hinge, where the hinge is configured to tilt toward a first raised address electrode and toward a second raised address electrode. The first micromirror pixel also comprises a first micromirror coupled to the hinge, where the first micromirror has a sculpted edge. The second micromirror pixel comprises a second micromirror, where a first gap between a first point on the sculpted edge and a nearest point to the first point on the second micromirror is larger than a second gap between a second point on the sculpted edge and a nearest point to the second point on the second micromirror.

A spectroscopic measurement apparatus includes a fixed substrate, a movable substrate, and a wavelength variable interference filter which includes an electrostatic actuator for changing the gap dimension between the substrates, a vibration disturbance detection unit which detects vibration added to the wavelength variable interference filter, and a bias driving unit which applies a feed-forward voltage based on a detected value of the vibration disturbance detection unit to the electrostatic actuator.

Described herein are accelerometers, apparatus and systems incorporating accelerometers, and techniques for electrostatically adjusting a stiffness of a spring system in an accelerometer. Embodiments featuring resonant and/or quasi-static accelerometers are described. In certain embodiments, an accelerometer is a microelectromechanical systems (MEMS) device including a proof mass, an anchor, a spring attached to the proof mass, a sense electrode, and a tuning electrode. The spring and the proof mass form a spring system suspended from the anchor. The sense electrode is configured to generate a signal indicating movement of the proof mass based on application of a first signal. The tuning electrode is configured to receive an electrostatic tuning signal, the electrostatic tuning signal being separate from the first signal and providing a negative contribution to an overall stiffness of the spring system. The electrostatic tuning signal can be used to adjust the stiffness based on a measured acceleration.

A modification to rough polysilicon using ion implantation and silicide is provided herein. A method can comprise depositing a hard mask on a single crystal silicon, patterning the hard mask, and depositing metal on the single crystal silicon. The method also can comprise forming silicide based on causing the metal to react with exposed silicon of the single crystal silicon. Further, the method can comprise removing unreacted metal and stripping the hard mask from the single crystal silicon. Another method can comprise forming a MEMS layer based on fusion bonding a handle MEMS with a device layer. The method also can comprise implanting rough polysilicon on the device layer. Implanting the rough polysilicon can comprise performing ion implantation of the rough polysilicon. Further, the method can comprise performing high temperature annealing. The high temperature can comprise a temperature in a range between around 700 and 1100 degrees Celsius.

A MEMS includes a substrate having a cavity, and a moveable element arranged in the cavity, the moveable element including a first electrode, a second electrode and a third electrode that is arranged between the first electrode and the second electrode and is fixed in an electrically insulated manner from the same at discrete areas. The moveable element is configured to perform a movement along a movement direction in a substrate plan in response to an electric potential between the first electrode and the third electrode or in response to an electric potential between the second electrode and the third electrode. A dimension of the third electrode perpendicular to the substrate plane is lower than a dimension of the first electrode and a dimension of the second electrode perpendicular to the substrate plane.

A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.