A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

Active surface structures comprise an exposed surface, a controlled group of MEMS (micro-electro-mechanical system) actuators, and a controlled region of the exposed surface corresponding to the controlled group. The controlled region has a first state, and a second state that is less textured than the first state. Active surface structures may be part of an apparatus that includes a controller and/or one or more sensors. The controller, sensors, and the controlled region may form a feedback loop in which the active surface structure is actively controlled.

A MEMS microphone includes a substrate having a back cavity, a vibration diaphragm system, and a housing. The vibration diaphragm system includes at least two sub-vibration diaphragm assemblies, a slit is formed between adjacent two of the at least two sub-vibration diaphragm assemblies, one end, distal from the housing, of each of the at least two sub-vibration diaphragm assemblies is fixed to a cross beam assembly, and first gaps are formed between the at least two sub-vibration diaphragm assemblies and inner sides of the housing, so that the at least two sub-vibration diaphragm assemblies form a cantilever beam structure, which increases compliance of the vibration diaphragm system and further improves sensitivity of microphones.

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.

The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

A silicone member used for a micro device and a micro device which achieve both electrification suppression and light transmittance are provided. The silicone member is used as a micro device and has a holding part for holding samples, or defines the holding part through the combination with a counterpart member. The silicone member includes a silicone material which has silicone and an ionic conductive agent, and the content of the ionic conductive agent is 0.01 part by mass or higher and 1 part by mass or lower with respect to 100 parts by mass of the silicone. The micro device includes the silicone member.

Active superhydrophobic surface structures are actively-controlled surface structures exhibiting a superhydrophobic state and an ordinary state. Active superhydrophobic surface structures comprise an outer elastomeric covering defining an exposed surface, a controlled group of MEMS (micro-electro-mechanical system) actuators at least covered by the elastomeric covering, and, a controlled region of the exposed surface corresponding to the controlled group. The controlled region has a superhydrophobic state in which the controlled region is textured. The controlled region also has an ordinary state in which the controlled region is smooth (i.e., less textured than in the superhydrophobic state). Active superhydrophobic surface structures may be part of an apparatus that includes a controller and/or one or more sensors. The controller, sensors, and the controlled region may form a feedback loop in which the active superhydrophobic surface is actively controlled.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.