A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

An electrical circuit comprising at least two negative capacitance insulators connected in series, one of the two negative capacitance insulators is biased to generate a negative capacitance. One of the negative capacitance insulators may include an air-gap which is part of a nanoelectromechnical system (NEMS) device and the second negative capacitance insulator includes a ferroelectric material. Both of the negative capacitance insulators may be located between the channel and gate of a field effect transistor. The NEMS device may include a movable electrode, a dielectric and a fixed electrode and arranged so that the movable electrode is attached to at least two points and spaced apart from the dielectric and fixed electrode, and the ferroelectric capacitor is electrically connected to either of the electrodes.

An electrical circuit comprising at least two negative capacitance insulators connected in series, one of the two negative capacitance insulators is biased to generate a negative capacitance. One of the negative capacitance insulators may include an air-gap which is part of a nanoelectromechnical system (NEMS) device and the second negative capacitance insulator includes a ferroelectric material. Both of the negative capacitance insulators may be located between the channel and gate of a field effect transistor. The NEMS device may include a movable electrode, a dielectric and a fixed electrode and arranged so that the movable electrode is attached to at least two points and spaced apart from the dielectric and fixed electrode, and the ferroelectric capacitor is electrically connected to either of the electrodes.

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

An optical reflector element includes: a first oscillator and a second oscillator for oscillating a reflector and disposed with the reflector being interposed therebetween along a first axis; and a third oscillator for oscillating the first oscillator and the second oscillator. The third oscillator includes: a first assister that causes the support of the first oscillator and the support of the second oscillator to operate, by connecting the support of the first oscillator and the support of the second oscillator to one base included in a pair of bases disposed with the first axis being interposed therebetween; and a second assister that causes the support of the first oscillator and the support of the second oscillator to operate, by connecting the support of the first oscillator and the support of the second oscillator to an other base included in the pair of bases.

The invention provides a MEMS acoustic sensor, including: a base with a back cavity; a capacitance system fixed to the base, including a diaphragm that reciprocates in a vibration direction, a back plate spaced from the diaphragm; a first capacitor and a second capacitor formed cooperatively by the diaphragm and the back plate; and a number of through holes in the back plate facing the back cavity. The diaphragm includes a main body part opposite to the back plate for forming the first capacitor, and a plurality of combining parts recessed from the main body part. A projection of the combining part along the vibration direction completely falls into the through hole. The combining part is spaced from an inner wall of the through hole for forming the second capacitor. Due to the configuration of the invention, the acoustic sensor has improved capacitor value.

The invention provides a MEMS acoustic sensor, including: a base with a back cavity; a capacitance system fixed to the base, including a diaphragm that reciprocates in a vibration direction, a back plate spaced from the diaphragm; a first capacitor and a second capacitor formed cooperatively by the diaphragm and the back plate; and a number of through holes in the back plate facing the back cavity. The diaphragm includes a main body part opposite to the back plate for forming the first capacitor, and a plurality of combining parts recessed from the main body part. A projection of the combining part along the vibration direction completely falls into the through hole. The combining part is spaced from an inner wall of the through hole for forming the second capacitor. Due to the configuration of the invention, the acoustic sensor has improved capacitor value.

A coil assembly for integration into a transducer is presented. The coil assembly may include a metal bobbin assembly, a wire coil, and one or more nonconductive printed circuit board (PCB) stiffeners. A speaker that renders micro noise in an artificial reality environment for improving simulated presence is further presented. The speaker may generate a plurality of micro noises based in part on the determined state of the virtual object. The speaker may spatialize the plurality of micro noises, such that the plurality of micro noises appears to originate from the virtual object. A speaker for speaker diaphragm motion detection using optical MEMS sensors is further presented. Optical MEMS sensors are used to optically monitor displacement of one or more portions of a speaker diaphragm. The speaker may be configured to determine that a speaker diaphragm is in rocking mode and move the speaker diaphragm out of rocking mode.

A coil assembly for integration into a transducer is presented. The coil assembly may include a metal bobbin assembly, a wire coil, and one or more nonconductive printed circuit board (PCB) stiffeners. A speaker that renders micro noise in an artificial reality environment for improving simulated presence is further presented. The speaker may generate a plurality of micro noises based in part on the determined state of the virtual object. The speaker may spatialize the plurality of micro noises, such that the plurality of micro noises appears to originate from the virtual object. A speaker for speaker diaphragm motion detection using optical MEMS sensors is further presented. Optical MEMS sensors are used to optically monitor displacement of one or more portions of a speaker diaphragm. The speaker may be configured to determine that a speaker diaphragm is in rocking mode and move the speaker diaphragm out of rocking mode.