B81C1/00015

High quality factor mems silicon flower-of-life vibratory gyroscope

A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

Method for coating microstructured components

The present disclosure provides a method for the surface modification of microstructured components having a polar surface, in particular for high-pressure applications. According to the method, a microstructured component is contacted, in particular treated, with a modification reagent, wherein the surface properties of the component are modified by chemical and/or physical interaction of the component surface and of the modification reagent.

MICRO-ELECTROMECHANICAL SYSTEM PUMP

A MEMS pump includes a first substrate, a first oxide layer, a second substrate, a second oxide layer, a third substrate and a piezoelectric element sequentially stacked to form a modular structure. The first substrate has an inlet aperture. The first oxide layer has at least one fluid inlet channel and a convergence chamber. One end of the fluid inlet channel is in communication with the convergence chamber and the other end of the fluid inlet channel is in communication with the inlet aperture. The second substrate has a through hole misaligned with the inlet aperture and in communication with the convergence chamber. The second oxide layer has a gas chamber with a concave central portion. The third substrate has a plurality of gas flow channels misaligned with the through hole. The modular structure has a length, a width and a height.

METHOD OF MANUFACTURING A MICROSTRUCTURE
20220388837 · 2022-12-08 ·

There is provided a method of producing a microstructure that comprises employing a hydrogen fluoride (HF) vapour to etch a sacrificial layer of silicon dioxide (SiO.sub.2) and thereafter removing a residual layer formed when HF vapour etching the layer of silicon dioxide. The residual layer may comprise silicon, ammonium salt or carbon and various techniques are disclosed for removing such layers. These techniques may be applied concurrently, or sequentially, to the microstructure. The described methodologies therefore produce microstructures that exhibits reduced levels of residue when as compared to those techniques known in the art.

PIEZOELECTRIC SINGLE-CRYSTAL ELEMENT, MEMS DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME
20230120240 · 2023-04-20 · ·

The present disclosure relates to a piezoelectric single-crystal element, a MEMS device using same, and a method for manufacturing same, wherein the piezoelectric single-crystal element includes a wafer, a lower electrode stacked on the wafer, a piezoelectric single-crystal thin film stacked on the lower electrode, and an upper electrode stacked on the piezoelectric single-crystal thin film, wherein the piezoelectric single-crystal thin film is composed of PMN-PT, PIN-PMN-PT or Mn:PIN-PMN-PT, and the piezoelectric single-crystal thin film has a polarization direction set to a <001> axis, a <011> axis or a <111> axis, and a MEMS device using same.

CHARGE TRANSFER CIRCUITRY FOR MEMS DEVICES

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

Transfer system for microelements

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20170359648 · 2017-12-14 ·

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

Method for making a suspended membrane structure with buried electrode

A microsystem and/or nanosystem type device is disclosed, comprising: a first substrate, or intermediate substrate, comprising a mobile part, a second substrate or support substrate, at least one lower electrode, and one dielectric layer (101) located between the first and second substrates, the dielectric layer being arranged between the lower electrode and the first substrate; the first substrate comprising through vias filled with conducting material in contact with said lower electrode.

Actuators based on unbalanced moments of inertia

Methods and computer-readable mediums are provide that, in some embodiments maximize bending of an actuator and, in other embodiments, minimize bending of the actuator. For example, in one embodiment, a method is provided that acquires a first ratio of a modulus of inertia for a first component to a Young's Modulus for the first component. The method also acquires a second ratio of a modulus of inertia for a second component to a Young's Modulus for the second component. Thereafter, the method provides an actuator (which includes the first component and second component). The actuator has a cross-sectional shape such that the first ratio substantially equal to said second ratio. In various embodiments of the invention, the actuator is spun fibers formed into batting and used as insulation, or may form an active element of a thermostat.