The purpose of the present invention is to provide a method for manufacturing a three-dimensionally structured member which can be made by a simpler process. The method for manufacturing a three-dimensionally structured member includes shaping a flat plate-shaped base member to produce a three-dimensionally structured member having a plurality of sections that are different from one another in thickness. The manufacturing method comprises: a mask formation step for forming a mask over the whole of at least one main surface of the base member; a mask removal step for removing a part of the mask; and an etching step for etching an exposed part of the base member wherein a combination of the mask removal step and the etching step is performed on the mask and the base member that correspond to each of the plurality of sections of the three-dimensionally structured member, in the order from thinnest to the thickest of thicknesses of the three-dimensionally structured members.

A master tool is provided with an ink pattern on a major surface thereof. The ink pattern is formed by a screen printing process. A stamp-making material is applied to the major surface of the master tool to form a stamp having a stamping pattern being negative to the ink pattern of the master tool. The stamping pattern is inked with an ink composition and contacted with a metalized surface to form a printed pattern on a metalized surface of a substrate according to the stamping pattern. Using the printed pattern as an etching mask, the metalized surface is etched to form electrically conductive traces on the substrate.

The present invention provides a method for preparing a micro-cavity array surface with an inclined smooth bottom surface based on an air molding method. The method includes: preparing a micro-cavity array surface; preparing an auxiliary microstructure polymer template, and performing plasma treatment on the auxiliary microstructure polymer template; uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary microstructure polymer template subjected to the plasma treatment; placing a gap bead in an empty position on the micro-cavity array surface; placing the auxiliary microstructure polymer template spread with the liquid polymer film on the gap bead on the micro-cavity array surface, maintaining this state, and feeding the auxiliary microstructure polymer template into a vacuum drying oven; and heating and solidifying the liquid polymer film, and separating the micro-cavity array surface to obtain the micro-cavity array surface with the inclined smooth bottom surface.

A material with a nanotexture comprising structures extending from a substrate. The structures are modified by coating the nanotexture with a protective coating and partially removing the coating, exposing a portion of the structure for functionalization.

A highly-ordered nano-structure array, formed on a substrate, mainly comprises a plurality of highly-ordered nano-structure units. Each of the highly-ordered nano-structure units forms a receiving compartment. One end of the receiving compartment opposite to the substrate has an opening. Each of the highly-ordered nano-structure units comprises at least one thin film layer. A periphery and a bottom of the receiving compartment are defined by an inner surface of a surrounding portion of the at least one thin film layer and a top surface of a bottom portion of the at least one thin film layer, respectively. The at least one thin film layer is made of at least one material selected from the group consisting of: metal, alloy, oxide, nitride, and sulfide.

An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.

The present invention provides a method for preparing a micro-cavity array surface with an inclined smooth bottom surface based on an air molding method. The method includes: preparing a micro-cavity array surface; preparing an auxiliary microstructure polymer template, and performing plasma treatment on the auxiliary microstructure polymer template; uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary microstructure polymer template subjected to the plasma treatment; placing a gap bead in an empty position on the micro-cavity array surface; placing the auxiliary microstructure polymer template spread with the liquid polymer film on the gap bead on the micro-cavity array surface, maintaining this state, and feeding the auxiliary microstructure polymer template into a vacuum drying oven; and heating and solidifying the liquid polymer film, and separating the micro-cavity array surface to obtain the micro-cavity array surface with the inclined smooth bottom surface.

This application relates to a method of forming nano-patterns on a substrate comprising the step of forming a plurality of nanostructures on a dielectric substrate, wherein the nanostructures are dimensioned or spaced apart from each other by a scaling factor of the dielectric substrate with reference to a silicon substrate.

The purpose of the present invention is to provide a method for manufacturing a three-dimensionally structured member which can be made by a simpler process. The method for manufacturing a three-dimensionally structured member includes shaping a flat plate-shaped base member to produce a three-dimensionally structured member having a plurality of sections that are different from one another in thickness. The manufacturing method comprises: a mask formation step for forming a mask over the whole of at least one main surface of the base member; a mask removal step for removing a part of the mask; and an etching step for etching an exposed part of the base member, wherein a combination of the mask removal step and the etching step is performed on the mask and the base member that correspond to each of the plurality of sections of the three-dimensionally structured member, in the order from thinnest to the thickest of thicknesses of the three-dimensionally structured members.

A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has a microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.