A process for transferring a useful layer to a carrier substrate including a first surface is provided, the process including the steps of: providing a donor substrate including a first surface, a weakened zone including implanted species, the useful layer, which is bounded by the weakened zone and by the first surface of the donor substrate, and an amorphous zone disposed, in the useful layer, parallel to the weakened zone; assembling, on a side of the first surface of the donor substrate and on a side of the first surface of the carrier substrate, the donor substrate with the carrier substrate by bonding, such that the amorphous zone is at least partially facing at least one cavity that is partially bounded by the first surface of the donor substrate; and splitting the donor substrate along the weakened zone so as to reveal the useful layer.

Disclosed herein is a novel a tunable Micro-Electro-Mechanical (MEMS) Etalon system including: a functional layer patterned to define a suspension structure for suspending a first mirror being an aperture mirror of the Etalon, an aperture mirror coupled to the suspension structure, and a back layer including a second mirror, being a back mirror of the Etalon. The functional layer may be located above the back layer and the back layer may include spacer structures protruding therefrom towards the aperture mirror to define a minimal gap between the aperture mirror and the back mirror and prevent collision between them. The aspect ratio between the width of the etalon/mirrors may be high (e.g. at least 500), and the minimal gap/distance between the mirrors may be small in the order of tens of nanometers (nm). Accordingly, in some implementations the parallelism between the aperture mirror and the back mirror is adjustable to avoid chromatic artifacts associated with spatial variations in the spectral transmission profile across the etalon.

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.

A method for processing a silicon wafer with a through cavity structure. The method is operated in accordance with the following sequence: performing ion implantation on a silicon wafer or pattern wafer; implanting a dummy substrate; bonding the silicon wafer to the pattern wafer; performing grinding and polishing, and thinning the pattern wafer to a depth exposing the pattern; bonding; and peeling the dummy substrate. Compared with the prior art, the present invention is standard in operation, and the product quality can be effectively guaranteed. The product has high cost performance and excellent comprehensive technical effect. The present invention has expectable relatively large economic values and social values.

A process for transferring a useful layer to a carrier substrate including a first surface is provided, the process including the steps of: providing a donor substrate including a first surface, a weakened zone including implanted species, the useful layer, which is bounded by the weakened zone and by the first surface of the donor substrate, and an amorphous zone disposed, in the useful layer, parallel to the weakened zone; assembling, on a side of the first surface of the donor substrate and on a side of the first surface of the carrier substrate, the donor substrate with the carrier substrate by bonding, such that the amorphous zone is at least partially facing at least one cavity that is partially bounded by the first surface of the donor substrate; and splitting the donor substrate along the weakened zone so as to reveal the useful layer.

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.

Disclosed herein is a novel a tunable Micro-Electro-Mechanical (MEMS) Etalon system including: a functional layer patterned to define a suspension structure for suspending a first mirror being an aperture mirror of the Etalon, an aperture mirror coupled to the suspension structure, and a back layer including a second mirror, being a back mirror of the Etalon. The functional layer may be located above the back layer and the back layer may include spacer structures protruding therefrom towards the aperture mirror to define a minimal gap between the aperture mirror and the back mirror and prevent collision between them. The aspect ratio between the width of the etalon/mirrors may be high (e.g. at least 500), and the minimal gap/distance between the mirrors may be small in the order of tens of nanometers (nm). Accordingly, in some implementations the parallelism between the aperture mirror and the back mirror is adjustable to avoid chromatic artifacts associated with spatial variations in the spectral transmission profile across the etalon.