The present invention relates to a scanning probe microscope. The scanning probe microscope can be configured to remove a polymeric material from a surface of a nanostructure. The scanning probe microscope includes a metal coated probe tip and a voltage source. The voltage source can be configured to apply a bias voltage between the probe tip and a sample. The bias voltage can be between 0.5 V and 2 V. The scanning probe microscope further includes a sample positioner configured to position the sample in relation to the probe tip and a system controller configured to control the scanning probe microscope.

The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

A microelectromechanical systems (MEMS) package includes a eutectic bonding structure free of a native oxide layer and an anti-stiction layer, while also including a MEMS device having a top surface and sidewalls lined with the anti-stiction layer. The MEMS device is arranged within a MEMS substrate having a first eutectic bonding substructure arranged thereon. A cap substrate having a second eutectic bonding substructure arranged thereon is eutectically bonded to the MEMS substrate with a eutectic bond at the interface of the first and second eutectic bonding substructures. The anti-stiction layer lines a top surface and sidewalls of the MEMS device, but not the first and second eutectic bonding substructures. A method for manufacturing the MEMS package and a process system for selective plasma treatment are also provided.

The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

The present invention relates to a method for removing a polymeric material from a surface of a nanostructure. The method includes applying, by a scanning probe microscope, an electrical field between a probe tip of the scanning probe microscope and the nanostructure, and simultaneously scanning over the surface of the nanostructure. Thereby, bonds connecting the polymeric material to the surface of the nanostructure are broken. A further step includes cleaning the surface of the nanostructure. A scanning probe microscope for performing such a method and a computer program product for controlling the scanning probe microscope are also disclosed.

A method and system for effectively removing particles from semiconductor surfaces using a multi-beam laser-based approach. The invention employs a plurality of laser beams generated by a spatial light modulator, which create multiple light spots on a particle at various locations across its surface. By adjusting the phase of these laser beams, alternating clockwise and counterclockwise torsional forces are induced, generating rotational movement that weakens the adhesion between the particles and the semiconductor surface. The system utilizes a liquid crystal spatial light modulator to precisely control beam parameters, enhancing the ability to reduce adhesion forces due to van der Waals interactions or electrostatic forces. An automated optical inspection system provides real-time monitoring and feedback, ensuring precise manipulation and complete removal of particles. An airstream is subsequently employed to detach and remove the loosened particles, thereby improving semiconductor surface cleanliness without causing mechanical damage.