In an example, a method of manufacturing a MEMS device includes forming a via. The method also includes depositing metal in the via and depositing a first layer of a non-photoactive organic polymer on the metal. The method includes baking the first layer of the non-photoactive organic polymer. The method also includes depositing a second layer of the non-photoactive organic polymer on the first layer of the non-photoactive organic polymer after baking the first layer of the non-photoactive organic polymer. The method includes baking the second layer of the non-photoactive organic polymer. The method also includes etching the first layer and the second layer of the non-photoactive organic polymer.

A method for producing a microelectronic device, in particular a MEMS chip device, comprising at least one carrier substrate. At least one electrodynamic actuator made of a metal conductor formed at least largely of copper is applied to the carrier substrate in at least one method step. At least one piezoelectric actuator is applied to the carrier substrate in at least one further method step.

This disclosure relates to the process of etching and treatment of side walls while processing microdevices. One aspect is to fill the device wall indentation with a polymer. The disclosure relates to a method and device with its structure to the process of etching and treatment of sidewalls. The methods of etching, coating, and curing are used.

Preferably, the invention relates to a MEMS package having at least one layer for protecting a MEMS element, wherein the MEMS element has at least one MEMS interaction region on a substrate and a surface conformal coating of the MEMS element is applied with a dielectric layer. Particularly preferably, the invention relates to a MEMS transducer package in which a MEMS element, for example with a MEMS membrane and processor, preferably an integrated circuit, are present on a substrate. For protection, a surface conformal coating of a dielectric is preferably first applied to the MEMS element, for example by spray coating, mist coating, and/or vapor coating. Then, preferably, an electrically conductive layer is applied. Depending on the configuration, the layers may be removed in some regions above a MEMS interaction region of the MEMS element, for example for a sound port of a MEMS membrane.

In an example, a method of manufacturing a MEMS device includes forming a via. The method also includes depositing metal in the via and depositing a first layer of a non-photoactive organic polymer on the metal. The method includes baking the first layer of the non-photoactive organic polymer. The method also includes depositing a second layer of the non-photoactive organic polymer on the first layer of the non-photoactive organic polymer after baking the first layer of the non-photoactive organic polymer. The method includes baking the second layer of the non-photoactive organic polymer. The method also includes etching the first layer and the second layer of the non-photoactive organic polymer.

In an example, a MEMS device includes MEMS elements supported on a substrate. The MEMS elements satisfy one or more uniformity metrics. Various uniformity metrics may be used, include tilt angle of each MEMS element, height of each MEMS element, and shape of each MEMS element. To maintain uniformity among the MEMS elements are constructed such that the tilt angles, heights, and/or shapes of the MEMS elements are within acceptable range(s). In other examples, the MEMS elements may be on a wafer, in which case the uniformity metric(s) may be enforced across the wafer. The uniformity metric(s) may also be enforced across multiple wafers.