A system for treating printed circuit board wastewater (PCB) includes a production system, a pretreatment system, a biochemical system, a recovery system and a concentrated water treatment system. The production system is configured for producing process water and auxiliary water from tap water. The pretreatment system is configured to pretreat different wastewater samples separately. The biochemical system is configured to decompose the pretreated wastewater. The recovery system is configured to treat wastewater from the pretreatment system and the biochemical system to obtain process water and feed concentrated water to the concentrated water treatment system. The concentrated water treatment system is configured to treat the concentrated water to meet a discharge standard. A treatment method for the PCB wastewater is also provided.

An electrostatic purification device includes a purification tank housing configured to accommodate a fluid, a first electrode and a second electrode provided in the purification tank housing, a direct current (DC) power supply configured to apply a DC to the first electrode and the second electrode, a controller configured to monitor a current density between the first electrode and the second electrode, and determine whether purification is completed based on the current density, a first valve configured to control an introduction flow of the fluid into the purification tank housing, a second valve configured to control a discharge flow of the fluid from the purification tank housing, and a heat exchanger configured to cool the fluid accommodated in the purification tank housing.

A method and system of providing ultrapure water for semiconductor fabrication operations is provided. The water is treated by utilizing a free radical scavenging system. The free radical scavenging system can utilize actinic radiation with a free radical precursor compound, such as ammonium persulfate. The ultrapure water may be further treated by utilizing ion exchange media and degasification apparatus. A control system can be utilized to regulate a continuously variable intensity of the actinic radiation.

A system for treating a tetraalkylammonium hydroxide-containing liquid having a high-pressure type reverse osmosis membrane device concentrating a liquid to be treated containing tetraalkylammonium hydroxide at a concentration side, and a line for supplying the concentrated liquid to be treated by the reverse osmosis membrane device to an evaporator further concentrating the concentrated liquid to be treated.

The present disclosure provides methods, electrodes, and systems for electrochemical oxidation of polyfluoroalkyl and perfluroalkyl (PFAS) contaminants using Magnéli phase titanium suboxide ceramic electrodes/membranes. Magneli phase titanium suboxide ceramic electrodes/membranes can be porous and can be included in reactive electrochemical membrane filtration systems for filtration, concentration, and oxidation of PFASs and other contaminants.

A real-time wastewater treatment and water quality monitoring system includes a plurality of wastewater treatment facilities configured to purify wastewater generated from semiconductor manufacturing lines, a plurality of contaminant analysis apparatuses configured to obtain and analyze a sample from effluent water discharged through discharge pipes of the wastewater treatment facilities respectively, discharge rate sensors installed in the discharge pipes respectively, and an integrated monitoring apparatus configured to receive measurement result values from the contaminant analysis apparatuses and the discharge rate sensors and monitor in real time concentration of a contaminant in an entirety of the effluent water that is purified and discharged from the wastewater generated in the semiconductor manufacturing lines.

Per- and polyfluoroalkyl substances (PFAS) are destroyed by oxidation in supercritical conditions. PFAS in water is concentrated in a reverse osmosis step and salt from the resulting solution is removed in supercritical conditions prior to destruction of PFAS in supercritical conditions.

The present invention provides a filtering apparatus for lens polishing wastewater and a system for reducing polishing wastewater, which efficiently remove fine particles such as lens particles and fine lens particles that are mixed into polishing water in a lens cutting and polishing process in a lens polishing machine such as an edger, to reduce the polishing water to be reused in lens polishing, and can prevent water pollution by fundamentally preventing the discharge of polishing water in which fine particles are mixed.

A method and system is provided for treating waste generated from manufacturing operations including at least one of Printed Circuit Boards Fabrication (PCB FAB), General Metal Finishing (GMF), semiconductors manufacturing, chemical milling, and Physical Vapour Deposition (PVD). The method and system are used to create zero liquid discharge recycling.

Various examples related to resin wafer technologies including ionomers and resin wafers with solution processable ionomers and their production are provided. In one example, a wafer includes an ion conducting layer having ion-exchange resin particles and an ionomer binder coating the ion-exchange resin particles. The ionomer binder can bind the ion-exchange resin particles together in the ion conducting layer. In another example, the wafer can contain water dissociation catalysts for promoting water-splitting in the wafers.