A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.

A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Glass articles and methods for producing glass articles for a portable electronic device are disclosed. Properties of the glass articles, such as cover members, are improved through chemical strengthening, thermoforming, or a combination thereof. The glass articles may include barrier layers to prevent diffusion of ions between glass layers of the glass article, internal compressive stress regions, or a combination thereof.

Glass articles and methods for producing glass articles for a portable electronic device are disclosed. Properties of the glass articles, such as cover members, are improved through chemical strengthening, thermoforming, or a combination thereof. The glass articles may include barrier layers to prevent diffusion of ions between glass layers of the glass article, internal compressive stress regions, or a combination thereof.

A method of joining glass substrates is disclosed. The method positions a first glass substrate onto a translational stage and a second glass substrate onto the first glass substrate. In some examples, a gap is defined by contact made between the first and second glass substrates. In such examples, the gap can be up to about 10 μm. Additionally, in such examples, the method includes focusing a beam of light within the first glass substrate proximate to the gap. Further, in such examples, the method includes joining the first and second glass substrates to one another in a manner that closes the gap as a result of the focusing of the beam of light within the first glass substrate. In various examples, the first and second glass substrates each exhibit a transmittance of at least about 90% at a wavelength of the beam of light.

A method of joining glass substrates is disclosed. The method positions a first glass substrate onto a translational stage and a second glass substrate onto the first glass substrate. In some examples, a gap is defined by contact made between the first and second glass substrates. In such examples, the gap can be up to about 10 μm. Additionally, in such examples, the method includes focusing a beam of light within the first glass substrate proximate to the gap. Further, in such examples, the method includes joining the first and second glass substrates to one another in a manner that closes the gap as a result of the focusing of the beam of light within the first glass substrate. In various examples, the first and second glass substrates each exhibit a transmittance of at least about 90% at a wavelength of the beam of light.

A property-enhanced cover sheet, and methods for forming a property-enhanced cover sheet, for a portable electronic device are disclosed. A property-enhanced cover sheet is formed by thermoforming a glass sheet into a specified contour shape while modifying one or more properties of the glass. Other property-enhanced sheets can be formed by layering two or more glass sheets having different material properties, and then thermoforming the layered sheets into a required contour shape. Property enhancement for a cover sheet includes, hardness, scratch resistance, strength, elasticity, texture and the like.

A property-enhanced cover sheet, and methods for forming a property-enhanced cover sheet, for a portable electronic device are disclosed. A property-enhanced cover sheet is formed by thermoforming a glass sheet into a specified contour shape while modifying one or more properties of the glass. Other property-enhanced sheets can be formed by layering two or more glass sheets having different material properties, and then thermoforming the layered sheets into a required contour shape. Property enhancement for a cover sheet includes, hardness, scratch resistance, strength, elasticity, texture and the like.